Osram Opto Semi-conductors Gmbh Co. Ohg

Other

Siemens Aktiengesellschaft

Osram Opto Semiconductors Gmbh

G&uuml;nter Waitl

Herbert Brunner

Norbert Stath

Peter Schlotter

Ralf Schmidt

Ulrike Reeh

Klaus H&ouml;hn

J&uuml;rgen Schneider

Karlheinz Arndt

Franz Schellhorn

Bernhard Bachl

Robert Lutz

Johann Feraric

The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Light-radiating semiconductor component with a luminescence conversion element

A method for producing a surface mounting optoelectronic component having comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, so whereby the optical device comes into contact with the casting compound.

Surface mounting optoelectronic component and method for producing same

An assembly device, in particular a fully automatic assembly device for producing microsystem technical products and for assembling components in the semiconductor industries, comprising an assembly table, a material transport system that transports the products to be placed with components, at least one transport system mounted on the assembly table, and at least one movable component transport unit with at least one assembly head. The component transport unit(s) is/are arranged on one or more carrier system(s) displaceable by means of a transport system in parallel to the direction of transport of the products to be placed with components, which products are in turn displaced by the material transport system(s). The material transport system consists of at least two individual transport systems that run parallel, each individual transport system being provided with separately controllable drive systems, and the assembly device in addition comprising at least one information memory for receiving and processing component-specific data of a plurality of components within a component reservoir, and of data relative to the position thereof within the component reservoir, the control of the component transport unit(s) and/or the assembly table and of the thereon attached material transport system ensuing on the basis of these data.

Assembly device

A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured. Wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Optoelectronic semiconductor component

The invention describes a flexible multiple LED module having a plurality of rigid printed circuit boards, which are each connected at one of their main surfaces to a flexible printed circuit board with a spacing between one another, and a plurality of LEDs, which are mounted in the region of the rigid printed circuit boards on the flexible printed circuit board. The multiple LED module is suitable particularly for installation in luminaire housings, in particular for motor vehicles.

Flexible multiple led module, in particular for a luminaire housing of a motor vehicle

Growing community of inventors

Wuppertal, Germany

Günter Waitl

Growing community of inventors

Wuppertal, Germany

G&uuml;nter Waitl

Günter Waitl