Siltronic Ag

Wacker Siltronic Gesellschaft F&uuml;r Halbleiter Materialien Ag

Wacker Siltronic Gesellschaft F&uuml;r Halbleitermaterialien

G&uuml;nter Schwab

Maximilian Stadler

Karlheinz Langsdorf

Helmut Franke

Manfred Sch&ouml;fberger

Edeltraut Pichelmeier

A process for producing a semiconductor wafer is based upon etching the semiconductor wafer with an etching medium flowing in a laminar flow along a direction of flow toward an edge of the semiconductor wafer. There is a protective shield arranged in front of the edge of the semiconductor wafer, so that the etching medium flows onto the protective shield and not onto the edge of the semiconductor wafer. There is also a process that has the semiconductor wafer being inclined with respect to the direction of flow of the etching medium, so that there is an angle of less than 180&deg; between the direction of flow of the etching medium and a first side of the semiconductor wafer. Also, there is an angle of greater than 180&deg; between the direction of flow of the etching medium and a second side of the semiconductor wafer, and the second side of the semiconductor wafer is subsequently polished.

Process for producing a semiconductor wafer

A process for the wet chemical treatment of a semiconductor wafer in a vessel, in which the semiconductor wafer is brought into contact with a liquid in which very small gas bubbles are dispersed. Two circuits are set up for conveying the liquid, with a first circuit between a reservoir and the vessel, for conveying the liquid from the reservoir to the vessel; and with a second circuit from the reservoir back to the reservoir, in order to enrich the liquid with a gas on the way back to the reservoir, so that the gas bubbles can form.

Process for the wet chemical treatment of a semiconductor wafer

A process for the wet-chemical surface treatment of a semiconductor wafer following a mechanical surface treatment, in particular following a mechanical surface treatment in a lapping machine, includes a sequence of treatment steps. The process essentially includes a wet-chemical surface cleaning, preferably for neutralizing and eliminating the lapping slurry, an acid etching treatment, preferably for eliminating the mechanically imposed damage and for surface smoothing and removal of metals. There is a final step of drying and rendering the cleaned and etched surface hydrophilic.

Process for the wet-chemical surface treatment of a semiconductor wafer

Growing community of inventors

Emmerting, Germany

Günter Schwab

Growing community of inventors

Emmerting, Germany

G&uuml;nter Schwab

Günter Schwab