W.c. Heraeus Gmbh & Co Kg

W. C. Hereaus Gmbh & Co. Kg

W. C. Hereaeus Gmbh & Co. Kg

G&uuml;nter Herklotz

Thomas Frey

Jens Tr&ouml;tzschel

Matthias Frericks

Christoph Simons

Wulf Kock

Frank Kr&uuml;ger

Thomas Giesel

Heinz F&ouml;rderer

Y C Cho

J&uuml;rgen Reuel

Lutz Schr&auml;pler

A radially expandable support structure is presented, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped structure that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one of the partial structures ( ) extend without interruption in the axial direction generally from the first end to the second end of the tube-shaped structure. A first partial structure ( ) can be expanded at least in the radial direction and has at least one radial-expansion component. The individual radial expansion components ( ) are arranged as a helix or in a helix shape. A second partial structure ( ) is generally almost rigid in the axial direction. The two partial structures ( ) are arranged in such a way that during the radial expansion of the tube-shaped structure, the second partial structure ( ) receives the longitudinal axial forces that arise.

Radially expandable stent IV

A support structure is provided for holding open lumina, the support structure having a stainless steel substrate and a platinum layer forming the surface of the structure. The structure has at least one gold layer arranged between the substrate and the platinum layer. The platinum layer is preferably applied with a pulsed current with current reversal, in order to avoid or reduce brittleness occurring by absorption of hydrogen during galvanic deposition of platinum. Such a support structure (stent) substantially withstands the high mechanical stresses, particularly bending and torsional forces that occur during application, without the formation of significant tears in the platinum layer.

Support structure

A method for the manufacture of a leadless substrate with a basic body made of copper or copper base alloy, a solder layer applied to at least one portion of the basic body and made of metals belonging to the group of gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, as well as an intermediate layer arranged between the basic body and the solder layer and made of nickel or nickel alloy, wherein the solder layer consists of at least two separate layers made of different metals and wherein the intermediate layer and the separate layers are deposited by electroplating, characterized in that at least one separate layer is made of silver or silver alloy.

Method for producing a lead-free substrate

A radially expandable support structure is provided, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped body that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one partial structure (,) extends without interruption in the axial direction generally from the first end to the second end of the tube-shaped body. The first partial structure (,) can be expanded at least in the radial direction and has at least one radial-expansion component. Individual radial expansion components (,) are arranged as rings or in a ring shape, and the second partial structure (,) is almost rigid in the axial direction. The two partial structures (,) are arranged in such a way that during the radial expansion of the tube-shaped body, the second partial body (,) receives the longitudinal axial forces that arise.

Radially expandable stent V

A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.

Fine wire made of a gold alloy, method for its production, and its use

Growing community of inventors

Bruchköbel, Germany

Günter Herklotz

Growing community of inventors

Bruchköbel, Germany

G&uuml;nter Herklotz

Günter Herklotz