Advanced Micro Devices Corporation

Xilinx, Inc.

General Electric Company

Gamal Refai-ahmed

Suresh Ramalingam

Sandip Maity

Ying Zhou

David Peter Robinson

Chi-Yi Chao

Hoa Do

Mark Steinke

Paul Theodore Artman

Md Malekkul Islam

Aslam Yehia

Disclosed herein are electronic devices that utilized a thermal bus disposed on a backside of a printed circuit board (PCB) to route heat efficiently to a thermal management device disposed on the front side of the PCB, thus enhancing thermal regulation of integrated circuit (IC) devices mounted on the backside of the PCB.

Electronic device with below PCB thermal management

An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.

Frame for coupling of a thermal management device to a printed circuit board

Disclosed herein is a heat spreader for use with an IC package, the heat spreader having features for enhanced temperature control of the IC package. A heat spreader for use with an IC package is disclosed. In one example, the heat spreader includes a metal body that has a sealed internal cavity. A thermally conductive material fills the sealed internal cavity. The thermally conductive material has an interstitial space sufficient to allow fluid to pass therethrough. A first phase change material fills at least a portion of the interstitial space of the thermally conductive material.

Heat spreader for a semiconductor package

Growing community of inventors

Santa Clara, CA, United States of America

Gamal Refai-ahmed