Samsung Electronics Co., Ltd.

Gam-han Yong

Sang-Hyun Lee

Seong-deok Hwang

Jin-gi Hong

Dong-hyuck Kam

Sang-hyun Lee

Eui-seok Kim

Hun-Yong Park

A light-emitting apparatus includes a reflective layer including a cavity that penetrates the reflective layer from a top surface to a bottom surface of the reflective layer; a light-emitting device disposed in the cavity, the light-emitting device including a light-emitting stack and an electrode connected to the light-emitting stack at a bottom surface of the light-emitting stack; and a wavelength conversion layer that fills the cavity and covers a top surface and a side surface of the light-emitting device, wherein the wavelength conversion layer exposes at least a portion of the electrode to an outside.

Light-emitting apparatus and light-emitting module including the same

The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.

Light emitting device package

Growing community of inventors

Suwon-si, South Korea

Gam-han Yong