Honeywell International Inc.

Galen P Magendanz

Ijaz H Jafri

Jonathan L Klein

Mark Eskridge

Ryan Roehnelt

Michael Jarvis

Mark S Williams

Gary J Ballas

Peter H LaFond

Michael J Foster

Matt Loesch

An accelerometer device for reducing stress on the sensor resulting from temperature extremes and multiple coefficients of thermal expansion. An exemplary accelerometer device includes upper and lower stators and a reed. The reed includes a support ring and a paddle that is flexibly connected to the support ring. The support ring includes a ring section and at least two mounting devices. The mounting devices are at least partially mechanically isolated from the ring section. The ring section flexibly receives the paddle. The mounting devices include a pad area and a neck area that connect the pad area to the ring section. The neck area includes a width dimension that is narrower than a diameter dimension of the pad area.

Stress reduction components for sensors

A mounting system for a MEMS device includes a proof mass selectively coupled to a substrate using a centrally located, single anchor mount that minimizes sensitivity to strain variations experienced by the MEMS device. The mounting system may include isolation cuts arranged in the proof mass to advantageously achieve a desired amount of strain isolation and to produce hinges that extend in opposite directions from the anchor mount. The single anchor mount is arranged to reduce a separation distance from a mid-point or centroid of the anchor mount to its perimeter as compared to conventional mounting schemes that have multiple anchor mounts positioned distally from a common mid-point.

Mounting system for torsional suspension of a MEMS device

A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped.

Method of manufacturing vibrating micromechanical structures

Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.

MEMS devices and methods with controlled die bonding areas

A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer.

MEMS devices and methods of assembling micro electromechanical systems (MEMS)

A method for forming a vibrating micromechanical structure having a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; windows are opened in the active layer of the resonator wafer; masking the active layer of the resonator wafer with photoresist; a SCS resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist is subsequently dry stripped. A patterned SCS cover is bonded to the resonator wafer resulting in hermetically sealed chip scale wafer level vacuum packaged devices.

Vacuum packaged single crystal silicon device

A microelectromechanical system (MEMS) device with a mechanism layer having a first part and a second part, and at least one cover for sealing the mechanism layer. The inner surface of at least one of the covers is structured such that a protruding structure is present on the inner surface of the cover and wherein the protruding structure mechanically causes the first part to be deflected out of a plane associated with the second part.

Growing community of inventors

Issaquah, WA, United States of America

Galen P Magendanz