Hewlett-packard Development Company, L.p.

Galen P Cook

Michael W Cumbie

James Richard Przybyla

Garrett E Clark

Richard W Seaver

Frank D Derryberry

Bradley D Chung

Anthony M Fuller

Si-lam Choy

Sadiq Bengali

Si-Iam J Choy

Si-Lam J Choy

Valerie J Marty

Robert K Messenger

Chien-Hua Chen

Alexander N Govyadinov

Adam L Ghozeil

Erik D Torniainen

Sterling Chaffins

David P Markel

Michael G Monroe

Chantelle Domingue

Arun K Agarwal

Chris Bakker

Paul A Richards

Jason Cassidy Hower

Ron Burns

Garrard Hume

Daniel Fradl

Michael H Hayes

Chantelle Elizabeth Domingue

In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

Nozzle arrangements

Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.

Nozzle arrangements and supply channels

In one example in accordance with the present disclosure, an additive manufacturing module is described. The additive manufacturing module includes an agent distributor to selectively distribute a fabrication agent onto layers of build material. The agent distributor includes at least one fluidic ejection die. Each fluidic ejection die includes a plurality of nozzles arranged along a die length and a die width, the plurality of nozzles arranged such that, for each set of neighboring nozzles, a respective subset of each set of neighboring nozzles are positioned at different die width positions along the width of the fluidic ejection die. The fluidic ejection die also includes, for each respective nozzle of the plurality of nozzles, a respective ejection chamber fluidically coupled to the respective nozzle and for each respective ejection chamber, at least one respective fluid feed hole fluidically coupled to the respective ejection chamber.

Additive manufacturing with nozzles at different die widths

A fluid recirculation channel for dispensing a plurality of fluid drop weights includes a number of sub-channels. The sub-channels include at least one pump channel, and a plurality of drop generator channels fluidically coupled to the at least one pump channel. The fluid recirculation channel further includes a number of pump generators incorporated into the at least one pump channel, a number of drop generators incorporated into drop generator channels, and a plurality of nozzles defined within the drop generator channels, the nozzles being at least as numerous as the number of drop generators.

Fluid recirculation channels

Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.

Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.

Nozzle arrangements and feed holes

Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.

A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

Fluid ejection structure

A method and apparatus provide a resistor electrically connected to an electrically conductive trace.

Resistor

An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.

Heating element for a printhead

A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a housing configured to store a quantity of fluid and an ejection assembly configured to controllably emit the fluid through a nozzle. The fluid dispenser also includes a fluid chamber configured both to supply a quantity of the fluid to the ejection assembly and to define a fluid flow path between the housing and the ejection assembly. The fluid dispenser further includes a filter positioned in the fluid flow path and configured both to conduct the fluid from the housing to the fluid chamber and to restrain particles in the fluid from entering the fluid chamber. The filter is further configured to define a bubble flow path that facilitates conduction of bubbles from the fluid chamber to the housing. Additional features of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.

Fluid dispenser

In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.

Fluid ejection assembly and related methods

A method of manufacturing a plurality of spacers in a film stack includes forming at least one electrically-conductive element having sidewalls on a substrate, depositing a plurality of passivation layers proximate to the substrate, and performing etching on one of the plurality of passivation layers to form a plurality of spacers substantially across from the sidewalls of the at least one electrically-conductive element.

Film stacks and methods thereof

A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.

Growing community of inventors

Albany, OR, United States of America

Galen P Cook