Broadcom Corporation

Knowles Electronics, Inc.

Galen Kirkpatrick

Sam Ziqun Zhao

Edward Law

Ming Wang Sze

Eric J Lautenschlager

Reza Khan

A semiconductor package includes a semiconductor unit containing an active circuitry layer. The semiconductor package also includes a plurality of bonding pads on the active circuitry layer, which are configured to be connected to corresponding external conductive connectors. The semiconductor package also includes a protective sealant coating filling grooved edges of the active circuitry layer. The protective sealant coating contains an exterior wafer-singulated surface.

Semiconductor border protection sealant

A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.

Compact, highly integrated microphone assembly

Growing community of inventors

Redondo Beach, CA, United States of America

Galen Kirkpatrick