Average Co-Inventor Count = 3.29
ph-index = 30
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (62 from 1,847 patents)
2. Ziptronix, Inc. (26 from 52 patents)
3. Invensas Bonding Technologies, Inc. (2 from 5 patents)
90 patents:
1. 12417950 - Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
2. 12412808 - Cold plate and manifold integration for high reliability
3. 12406959 - Post CMP processing for hybrid bonding
4. 12406975 - Techniques for processing devices
5. 12381173 - Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface
6. 12381128 - Structures with through-substrate vias and methods for forming the same
7. 12368087 - Embedded cooling systems for advanced device packaging and methods of manufacturing the same
8. 12341125 - Dimension compensation control for directly bonded structures
9. 12341083 - Electronic device cooling structures bonded to semiconductor elements
10. 12336141 - Cold plate cavity designs for improved thermal performance
11. 12322677 - Fluid channel geometry optimizations to improve cooling efficiency
12. 12300662 - DBI to SI bonding for simplified handle wafer
13. 12283490 - Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same
14. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
15. 12266545 - Structures and methods for integrated cold plate in XPUs and memory