Chang Chun Plastics Co., Ltd.

Gai-Chi Chen

An-Pang Tu

Kuen-Yuan Hwang

Ping-Chieh Wang

Kuen Yuan Hwang

An Pang Tu

Ching-Jui Huang

Sung-Kuang Chung

Yun-Chung Wu

Szu-Fang Chen

Chun-Hsiung Kao

Chia-En Wu

Zhao-Ming Chen

Phosphorous containing compounds, epoxy resins thereof, and laminate composite structures thereof. The phosphorus containing compounds may have a structure according to formula (I): wherein, X is an aromatic hydrocarbon group having 6 to 30 carbon atoms or a bivalent linear or branched alkylene group of 1 to 8 carbon atoms; Ris selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group, a napthyl group, and an aromatic phenol group; w is an integer of 1 to 9; R, R, R, and Rare independently selected from H, C-Calkyl, C-Calkoxy, and C-Ccycloalkyl; Ris selected from the group consisting of C-Calkyl, C-Calkoxy, C-Ccycloalkyl, and Ar; and Arand Arare independently selected.

Phosphorus containing compounds and epoxy resins thereof

The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.

Phosphorous containing epoxy resins and process for synthesis

The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.

Photosensitive resin composition and dry film photoresist containing the same

The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

Polyether compounds having epoxy hydroxyl urethane groups and waterborne epoxy resin composition

The present invention provides a phosphorus-containing compound of formula (I): wherein R, R, Rand Rare the same or different; and R, R, Rand Rare independently selected from the group consisting of hydrogen, halogen, Calkyl, haloalkyl, and alkoxy. The phosphorus-containing compound is prepared by bonding a bisphenol group to a phosphorus atom to prevent the phosphorus-containing heterocyclic molecule from exhibiting steric hindrance on hydroxyl functional groups, thereby increasing reactivity in the subsequent reactions.

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Taipei, Taiwan

Gai-Chi Chen