Adeia Semiconductor Bonding Technologies Inc.

Gaetan Mathiew

Gary W Grube

Igor Y Khandros

Thomas H DiStefano

Jason Sweis

John A Grange

A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

Semiconductor connection components and methods with releasable lead

Methods of making semiconductor connection components with releasable

Semiconductor connection components and method with releasable lead

A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.

Semiconductor inner lead bonding tool

Growing community of inventors

Carmel, NY, United States of America

Gaetan Mathiew