Formfactor, Inc.

Adeia Semiconductor Bonding Technologies Inc.

Berkeley Lights, Inc.

Other

University of California

Formfactor, Et Al.

Gaetan L Mathieu

Benjamin N Eldridge

Igor Y Khandros

Gary W Grube

Benjamin N Eldridge, Jr

Makarand S Shinde

David V Pedersen

Eric D Hobbs

Thomas H Dozier, Ii

Richard A Larder

Alexander H Slocum, Jr

Rod Martens

Ken S Matsubayashi

Thomas H Dozier

J Tanner Nevill

A Nicholas Sporck

Carl V Reynolds

Timothy E Cooper

William D Smith

Michael A Stadt

Treliant Fang

Jason Sweis

Alec Madsen

Poya Lotfizadeh

Thomas H DiStefano

Keith J Breinlinger

Mark P White

Daniele Malleo

David A Gibson

Stuart W Wenzel

Chih-Chiang Tseng

Chadwick D Sofield

Laurie Union

Gary William Grube

Richard Stephen Roy

Ming C Wu

Barbara Vasquez

Jian Gong

Randall D Lowe, Jr

Kevin T Chapman

Kenneth Burton Gilleo

Justin K Valley

Ming-Chiang Wu

Onnik Yaglioglu

Shao Ning Pei

Thomas N Watson

Jodi Tsu-An Loo

Lunyu Ma

Steven T Murphy

Charles A Miller

John K Gritters

John A Grange

Rodney I Martens

Yoshikazu Hatsukano

Jim Chih-Chiang Tseng

Christopher C Buckholtz

David V Pederson

Michael Harburn

Jimmy Kuo Chen

Alex Madsen

Michael A Drush

Frank M Zalar

Jason M Mcewen

Alexander Slocum

A group of micro-objects in a holding pen in a micro-fluidic device can be selected and moved to a staging area, from which the micro-objects can be exported from the micro-fluidic device. The micro-fluidic device can have a plurality of holding pens, and each holding pen can isolate micro-objects located in the holding pen from micro-objects located in the other holding pens or elsewhere in the micro-fluidic device. The selected group of micro-objects can comprise one or more biological cells, such as a clonal population of cells. Embodiments of the invention can thus select a particular group of clonal cells in a micro-fluidic device, move the clonal cells to a staging area, and export the clonal cells from the micro-fluidic device while maintaining the clonal nature of the exported group.

Exporting a selected group of micro-objects from a micro-fluidic device

Individual biological micro-objects can be deterministically selected and moved into holding pens in a micro-fluidic device. A flow of a first liquid medium can be provided to the pens. Physical pens can be structured to impede a direct flow of the first medium into a second medium in the pens while allowing diffusive mixing of the first medium and the second medium. Virtual pens can allow a common flow of medium to multiple ones of the pens.

Pens for biological micro-objects

Single-sided optoelectrowetting (SSOEW)-configured substrates are provided, as well as microfluidic devices that include such substrates. The substrates can include a planar electrode, a photoconductive (or photosensitive) layer, a dielectric layer (single-layer or composite), a mesh electrode, and a hydrophobic coating. Fluid droplets can be moved across the hydrophobic coating of such substrates in a light-actuated manner, upon the application of a suitable AC voltage potential across the substrate and the focusing of light into the photoconductive layer of the substrate in a location proximal to the droplets. Walls can be disposed upon the substrates to form the microfluidic devices. Together the walls and substrate can form a microfluidic circuit, through which droplets can be moved.

Single-sided light-actuated microfluidic device with integrated mesh ground

An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Sharpened, oriented contact tip structures

A probe head can comprise a substrate and electrically conductive structures extending from opposite surfaces of the substrate. The probe head can be made by forming frame structures each comprising a frame to which a row of the conductive structures is coupled. The frame structures can be placed in a stack. A compressible shim or a curable adhesive can be provided between adjacent frames in the stack to control a distance between the contact ends of the conductive structures in adjacent rows of the conductive structures. The frames can include cavities that form a mold while the frames are in the stack, and the substrate can be formed by introducing a moldable material into the mold. After the moldable material hardens, the frame can be removed, leaving the conductive structures embedded in the substrate.

Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a 'temporary' (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing.

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.

Wiring substrate with customization layers

A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

Probe card assembly having an actuator for bending the probe substrate

A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Method to build robust mechanical structures on substrate surfaces

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are 'stacked up' so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Probe card assembly and kit, and methods of making same

Carbon nanotube columns each comprising carbon nanotubes can be utilized as electrically conductive contact probes. The columns can be grown, and parameters of a process for growing the columns can be varied while the columns grow to vary mechanical characteristics of the columns along the growth length of the columns. Metal can then be deposited inside and/or on the outside of the columns, which can enhance the electrical conductivity of the columns. The metalized columns can be coupled to terminals of a wiring substrate. Contact tips can be formed at or attached to ends of the columns. The wiring substrate can be combined with other electronic components to form an electrical apparatus in which the carbon nanotube columns can function as contact probes.

Carbon nanotube columns and methods of making and using carbon nanotube columns as probes

Growing community of inventors

Livermore, CA, United States of America

Gaetan L Mathieu