Jenoptik Automatisierungstechnik Gmbh

Gabriele Eberhardt

Hans-Ulrich Zuehlke

Martin Griebel

Juergen Weisser

Norbert Preuss

Jan Grieger

Hans-Ulrich Zühlke

Torsten Linke

Patrick Mende

The invention relates to a method for severing brittle flat materials, for example made of glass, ceramic, silicon, gallium arsenide or sapphire. The method includes the step of heating the flat material along desired dividing lines below its melting temperature by means of a laser alone desired separating lines. Then the material is shocked by a coolant jet so that a thermally-induced mechanical stress difference brings about a material separation. Traces are formed in the flat material in advance along the separation lines, so that the flat material has a lower breaking stress along the traces than in the unworked flat material, and the separation with the laser takes place along these traces.

Method for severing brittle flat materials by laser beam with previously produced traces

The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.

Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser

The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are generated in that the disk is first cooled proceeding from its underside at least along the planned severing lines toward the upper side of the disk, and the upper side of the disk is then acted upon by a laser beam along the planned severing lines. The description also relates to an apparatus for carrying out the method.

Method and apparatus for severing disks of brittle material, in particular wafers

A device for welding a plurality of thermoplastic plastic parts (parts to be joined) forming a hollow body with an opening by a laser, comprising a vacuum holder having a vacuum chamber which communicates with a vacuum pump, is open on one side and, together with the hollow body, forms a closed chamber that can be evacuated. When a vacuum is applied, the vacuum holder holds the hollow body stationary, holds the joined parts together and enables testing of the tightness of the weld.

Growing community of inventors

Jena, Germany

Gabriele Eberhardt