Stmicroelectronics S.r.l.

Safecertifiedstructure Tecnologia S.r.l.

Gabriele Bertagnoli

Daniele Caltabiano

Elio Guidetti

Mohammad Abbasi Gavarti

Method and investigation device associated therewith, for measuring stresses in an agglomerate structure including a binder and a bonded substance, comprising the steps of providing, at one or more points on said structure, at least one investigation device able to measure at least three deformations of said investigation device that are oriented relative to one another on three axes, detecting the corresponding at least three deformation measurements, and calculating a stress that is proportional to a combination of said at least three deformation measurements at the corresponding point.

Method and investigation device for measuring stresses in an agglomerate structure

A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.

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Turin, Italy

Gabriele Bertagnoli