Ati Technologies Ulc

Advanced Micro Devices Corporation

Gabriel Wong

Roden R Topacio

Michael Mantor

Gabriel H Loh

Rahul Kumar Agarwal

Neil McLellan

Alan Dodson Smith

Liane Martinez

Raja Swaminathan

Michael S Alfano

Silqun Leung

Rajagopalan Venkatramani

Renato Dimatula Gaddi

The disclosed computer-implemented method can include defining, by at least one processor, one or more boundary conditions. The method can additionally include importing, by the at least one processor, one or more tiles outlines that at least define importing, by the at least one processor, one or more tiles outlines that at least define a cell hierarchy for one or more chiplets. The method can also include defining, by the at least one processor and based at least in part on the one or more tiles outlines, one or more cells of the one or more chiplets at least in part by automatically filling one or more slave cells of the one or more chiplet with a same bump pattern as a master cell of the one or more chiplets. The method can further include generating, by the at least one processor and based at least in part on the defined boundary conditions and the defined one or more cells, a floorplan and bump placement for a package design. Various other methods, systems, and computer-readable media are also disclosed.

Systems and methods for generating a floorplan and bump placement for a package design

A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Creating interconnects between dies using a cross-over die and through-die vias

Various semiconductor chip packages with undermounted passive devices and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a first side of a carrier substrate where the carrier substrate includes a second side opposite the first side. At least one passive device is coupled to the second side of the carrier substrate. The at least one passive device includes at least one first terminal electrically coupled to the semiconductor chip and at least one second terminal adapted to couple to a printed circuit board.

Semiconductor chip package with undermount passive devices

A routing layer for a semiconductor die is disclosed. The routing layer includes pads for attaching solder bumps; bond-pads bonded to bump-pads of a die having an integrated circuit, and traces interconnecting bond-pads to pads. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces at least partially surrounding some pads so as to absorb stress from solder bumps attached to the pads. Parts of the traces that surround pads protect parts of the underlying dielectric material proximate the solder bumps, from the stress.

Routing layer for mitigating stress in a semiconductor die

A routing layer for a semiconductor die is disclosed. The routing layer includes traces interconnecting integrated circuit bond-pads to UBMs. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces arranged underneath the UBMs as to absorb stress from solder bumps attached to the UMBs. Traces beneath the UBMs protect parts of the underlying dielectric material proximate the solder bumps, from the stress.

Growing community of inventors

Richmond Hill, Canada

Gabriel Wong