Northrop Grumman Systems Corporation

Gabriel M Kuhn

Henry C Abbink

Daryl K Sakaida

Howard H Ge

A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Growing community of inventors

West Hills, CA, United States of America

Gabriel M Kuhn