US Government As Represented by the Secretary of the Army

USA As Represented by Secretary of the Navy

Gabriel L Smith

Nathan Scott Lazarus

Daniel Louis Jean

Adam A Wilson

Charles H Robinson

Robert H Wood

Sarah Salah Bedair

Thinh Q Hoang

Mark R Gelak

Lawrence C Fan

Daniel J Jean

Jeffrey Spencer Pulskamp

David Mark Hull

Luke J Currano

Darin J Sharar

John Frederick Kunstmann

Wade Babcock

Simon J Ghionea

Collin R Becker

Ralph E Balestrieri

Cory R Knick

Larry D Thomas, Jr

Sabrina M Curtis

Haotian Wang

Brian Isaacson

Gabriel P Anfinrud

Alexander O Randolph

Sensor interconnects and supports and methods of making them utilize phonon disruptors for increased thermal resistance while maintaining acceptable electrical signal quality in materials. Phonon disruptors include, but are not limited to, structural features such as interfaces, grain boundaries, and point scattering sites, for example, that are designed to scatter heat carriers while allowing electrons to pass through the material. Some embodiments herein involve designing selected stacks of alternating or sequential material pairs within sensor interconnects.

Phonon disruptors for increased thermal resistance without sacrificing electrical signal quality in thermal sensors

A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; releasing an element of the actuator from the sheet stock using the laser; and moving the released part relative to the sheet stock using laser ablation propulsion.

Method and apparatus for performing contactless laser fabrication and propulsion of freely moving structures

A deformable array of semiconductor devices, and a method of manufacturing such a deformable array. The deformable array comprises a plurality of islands, where each island contains at least one semiconductor device, and the plurality of islands are arranged in an auxetic geometry.

Deformable array of semiconductor devices

A method and apparatus for using a laser to form and release an element of an actuator. The method comprising forming an actuator from sheet stock using a laser, where the actuator is three dimensional; and releasing an element of the actuator from the sheet stock using the laser.

Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

Complex laser folding and fabrication

According to embodiments, an electric field sensor having a sensor electrode is constructed of an electrically conductive material and having one or more outwardly protruding pillars. A screen electrode overlies the sensor electrode and has one or more openings which register with the one or more pillars on the sensor electrode. At least one piezoelectric actuator is connected to the screen electrode so that, when excited by a voltage signal, the piezoelectric actuator modulates the screen electrode toward and away from the sensor electrode at the frequency of the periodic voltage signal. An output circuit configured to detect a voltage, a current output, or both, between the sensor electrode and the screen electrode which is proportional in magnitude to the strength of the electric field.

Electric field sensor

An acceleration switch array having at least two acceleration switches. Each acceleration switch includes a substrate, an anchor attached to the substrate, an electrically conductive mass disposed around the anchor and secured to the anchor by a spring assembly which permits movement of the mass relative to the anchor, and a plurality of electrical contacts positioned at circumferentially spaced positions around and outwardly from the mass. These electrical contacts are aligned along at least one orthogonal axis. A resistor array is electrically connected between the electric contacts of each acceleration switch for each orthogonal axis so that, upon contact between the mass and any of the electrical contacts, an electrical resistance is presented at an output terminal that is unique for each electrical contact for each acceleration switch.

Three-axis acceleration switch array

A method of forming a device on a substrate comprising creating a depository and at least one attached capillary; the depository being of millimeter scale; providing a liquid containing particles in the range 1 nanometer to 1 millimeter; depositing into the depository the liquid containing particles which flows into at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; which is used to form a device. A microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate, the depository being formed by at least one wall adjacent to the substrate; at least one capillary channel coupled to at least one depository that is formed by walls adapted to be filled with a liquid (by capillary action) comprising nanoparticles.

Apparatus and method for suspension wicking of nanoparticles into microchannels

An ultra-miniature, electro-mechanical, MEMS type safe and arming (S&A) device for medium- or large-artillery rounds, including, three sequenced S&A interlocks: a setback slider which provides a 1interlock with respect to an arming slider which moves due to the round's spin; a stop and release mechanism that holds the arming slider until a release command signal is initiated by the fuze circuit, triggering a spot charge which generates an expanding gas wave that flexes the latch arm from contact with the safety catch, unlocking the 2interlock, thereby freeing the arming slider to continue its motion into an arming position, unlocking the 3interlock, and aligning the parts of the firetrain within the device, such that upon signal from the fuze circuit to an output charge, the device will ignite the acceptor charge within the round.

Ultra-miniature electro-mechanical safety and arming device

A ultra-miniature, electro-mechanical, MEMS type safe and arming (S&A) device for medium- or large-artillery rounds, including, three sequenced S&A interlocks: a setback slider, which is positioned partially within and partially extending from an arming slider, such that, upon firing acceleration, the setback slider will compress into a channel within the arming slider (unlocking the 1interlock); freeing the arming slider to move toward its arming position under urging of the round's spin; a stop and release mechanism formed by a flexible latch arm which impacts upon a safety catch located within the frame in which the arming slider is mounted, such that the arming slider is stopped until a release command signal is initiated by the fuze circuit, triggering a spot charge which generates an expanding gas wave that flexes the latch arm from contact with the safety catch (unlocking the 2interlock), thereby freeing the arming slider to continue its motion into an arming position (unlocking the 3interlock) and aligning the parts of the firetrain within the device, such that upon signal from the fuze circuit an output charge from the device will ignite the acceptor charge within the round.

A MEMS contact acceleration switch may include a first non-conductive layer; a second, conductive layer next to the first layer; and a third, conductive layer next to the second layer. The third layer may include a generally circular, annular mass and a center anchor post disposed interior of the annular mass. At least one spiral spring may connect the annular mass to the center anchor post. The third layer may include an x-y plane detection electrode separated from the annular mass by a gap. A fourth conductive layer may be disposed next to the third layer. A fifth layer may be disposed next to the fourth layer and may include a z-axis detection electrode. A second z-axis detection electrode may be disposed on the first layer. A plurality of conductive vias may extend through the first layer and be in electrical communication with the detection electrodes.

Triaxial MEMS acceleration switch

An inertial shock bandpass filter for detecting a shock event between first and second acceleration levels. The inertial shock bandpass filter includes a primary inertial element and at least one secondary inertial element supported by respective spring arrangements. The inertial elements include complementary engageable gripping surfaces, which engage in response to an acceleration above the second acceleration level to prevent movement of the primary inertial element and prevent latch engagement. The primary inertial element will, in response to an acceleration between the first and second acceleration levels, engage the latch. An acceleration level below the first acceleration level is insufficient to cause either an engagement of the gripping surfaces or a latching of the primary inertial element.

MEMS inertial shock bandpass filter

A MEMS inertial delay device having a substrate layer, an intermediate layer and a device layer. A plurality of freely moveable interlocking masses are formed in the device layer along with springs which connect the masses to first and second supports. Movement of a first one of the interlocked masses, due to a shock event, allows subsequent masses to move, with a last mass including an activation member, movement of which causes operation of a mechanism, such as movement of a lock in a safe/arm arrangement in a munition round.

MEMS inertial delay device

A non-electric, multiple shock event sensing device has shock sensors coupled to a substrate and arranged in an array defined by a plurality of rows and at least one column. At any given time, only one row of shock sensors is readied for the detection of a shock event. The occurrence of a shock event is detected by the readied row while simultaneously causing a next successive row in the array to be readied for detection.

Multiple shock event sensing device

A multi-directional shock sensor including two masses arranged to move in directions, which are mutually perpendicular to one another. A moveable locking member prevents movement of a slider, which is used in the arming arrangement of a submunition. In response to an acceleration in a plane, one or both masses will move. The masses are operably coupled to the locking member to effect its movement out of its locking engagement with the slider, due to such acceleration.

Growing community of inventors

Odenton, MD, United States of America

Gabriel L Smith