Orthosensor Inc.

Cmc Wireless Components, Inc.

Gabriel Carrasco

Marc T Stein

Jonathan H Harris

Erich K Rubel

A measurement device suitable to measure a load applied by the muscular-skeletal system is disclosed. The measurement device can be a prosthetic component having an articular surface for measuring parameters of a joint in extension or flexion. A first and second support structure forms an enclosure having load-bearing surfaces. The first support structure includes at least one alignment feature extending from a surface. The second support structure includes a corresponding opening for receiving the alignment feature. The first and second support structures include a peripheral channel and corresponding flange to support sealing of the enclosure. Interior to the enclosure is the measurement system. The alignment feature couples through and aligns a first load plate, a sensor array, and a second load plate to surfaces of the first and second support structures. The sensor array is coupled to electronic circuitry in the enclosure via a unitary circuit board.

Measurement device for the muscular-skeletal system having alignment features

A measurement device suitable to measure a force, pressure, or load applied by the muscular-skeletal system is disclosed. The measurement module includes a unitary circuit board that couples electronic circuitry to sensors. In one embodiment, the sensors are integrated in the unitary circuit board. Using more than one sensor allows the position of applied load by the muscular-skeletal system to be measured. In one embodiment, the sensors of a sensor array can be elastically compressible capacitors. A load plate can underlie the sensor array. Similarly, a load plate can overlie the load plate. Load plates are rigid structures for distributing a force, pressure, or load. The measurement device can include an articular surface for allowing movement of the muscular-skeletal system. A remote system can be in proximity to the measurement device. The remote system can receive, process, and display data from the measurement module in real-time.

Measurement device for the muscular-skeletal system having load distribution plates

A substrate for a microelectronic package comprising a substrate that has grooves on a surface for bonding. A method for preparing a substrate for bonding comprising forming a grooved surface in the substrate for accepting a die for bonding, wherein the grooves are of sufficient size to provide a substantially uniform die bond, but no so large as to nullify the thermal path to the underlying substrate. A method for forming a bond between a substrate and a die comprising: providing a substrate and a die, wherein the substrate has grooves formed in a surface area for accepting the die for bonding and having a metallization thereon sufficient to form a eutectic bond with the die having a gold metallization thereon; and forming a eutectic bond between the substrate and the die comprising heating the substrate, contacting the metallized grooved surface of the substrate to the gold metallized surface of the die, scrubbing the die onto the substrate by moving the die back and forth while maintaining contact, and cooling the substrate and die. A microelectronic structure comprising a substrate and a die, wherein the substrate has grooves on a surface adapted for bonding with the die, and wherein a bond is formed between the substrate and the die.

Growing community of inventors

Chandler, AZ, United States of America

Gabriel Carrasco