Other

Raychem Limited

Gabe Cherian

Stephen Hunter Diaz

Leslie J Allen

William D Carlomagno

William M Robinson

David Crofts

Anthony James Moore

Willie K Grassauer

David K Haygood

Don E Saunders

Harry E White

Stephen Morris

Raymond Noel

John R Vinson

Thomas H Clifford

William M Deasy

H Paul Sherlock

A number of devices are described which can be used to generate electric power from the action of wind or other sources of vibration. The devices comprise Piezo electric materials, which are built into the devices in a way that can capture the generated electric power, and can conduct it to storage devices. Several embodiments are described.

Piezo electric effect power

The invention relates to food and beverage containers and the lids that are used to close such containers. During the manufacturing process, it is desirable to stack the lids one on top of the other before presenting them to the machine that will join the lids to the bodies of the containers. Some lids according to my previous invention have ancillary components attached to their main bodies, such as pull tabs that have raised lifter tips or punch tips. Sometimes, the lids have also certain recesses and/or protrusions below or above the main body of the lids. Such ancillaries and/or recesses or protrusions could disturb the integrity of the stacks. Some experts in the industry indicated that they consider that such a stack could be unacceptably SQUISHY. This invention proposes ways and methods and construction designs, which would eliminate such stacking problems, even in the presence of such ancillaries and/or recesses or protrusions or other similar irregular shapes. The stacks will not be squishy.

PT2 pull tab lids stacking

New heat spreaders are proposed to connect high power, high heat generating electronic devices to their downstream heat dissipating cooling components. First, the spreaders distribute the high heat flux over a wider surface area, thus reducing the flux to levels more easily handled by the downstream cooling system. Second, the spreaders incorporate flexible columns or elements to join the electronic devices to the main body of the spreader, so as to negate the undesirable effects of CTE mismatch. Columns with a higher standoff distance between the components are more flexible than a direct flat interface attachment between the heat source and the heat sink, and will have less chance of delaminating. Several embodiments are proposed and can be used in appropriate situations. The heat spreaders can be helpful in harsh environments and in high heat generating applications, such as spacecraft, satellites, as well as land locked high power computer systems.

SPRDR&#x2014;heat spreader&#x2014;tailorable, flexible, passive

The invention covers a number of alternative improvements to the prior art pull-tab used to open container such as soda cans. One improvement is by forming the nose of the pull tab at a certain angle to the body of the tab, thus allowing the user to tilt the tab thus lifting the pull tip higher and providing more room for the user to insert the finger tip under the pull tip thus making it easier to open the container. Another improvement is by rotating the pull tab a certain angle and making it follow a caming surface thus lifting the pull tip and again providing more room to insert the finger tip and making it easier to open the container.

PT1-2 pull tab

Several novel probes are shown, highlighting the designs and non-linear spring rates of their contact springs. These springs work in conjunction with a novel comb, which affects the movement of the springs tips, so as to create the desirable scrub or wipe at the surface of the contact pads of the devices under test. At least three versions of the probes are covered by the claims, where one probe works on one device, a second probe works on two devices and the third probe comprises a lid, which controls the protrusion distance of the spring tips above the housing surface, so as to protect the springs from getting damaged prematurely.

Probes with wipe

The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environmental conditions such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

OC2 oriented connections 2

Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

TFCC (TM) and SWCC (TM) thermal flex contact carriers

The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Interconnections resistant to wicking

The present invention relates generally to interconnections between electrical and electronic devices, such as integrated circuit packages, chips, wafers, substrates or printed circuit boards or similar electronic devices. The invention relates more specifically to springs, used to make connections to electrical elements and to applications of such springs in connectors or interconnection devices. More particularly the springs can be located adjacent to each other on small effective center distances to accommodate high-density electronic devices. Furthermore, the invention relates to connectors that comprise combs that are used in conjunction with such springs, to create and to control the wiping or scrubbing action, which can promote good electrical connection. Moreover, the invention uses such combs that are thermally matched to the electronic devices to improve the performance during thermal cycling procedures. Finally, this invention describes a number of connectors, test heads and test probes that utilize the above springs and combs.

Connector with wipe

Lid with pull tab

Pull tab

Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods. In this divisional application, the emphasis is on the first group.

MP3 micro probe

The present invention relates generally to interconnections between electronic devices, such as integrated circuit packages, chips, wafers, substrates or printed circuit boards or similar electronic devices; the invention relates more specifically to springs or equivalent means, used to make connections to electrical elements and to applications of such springs in connectors or interconnection devices. More particularly the springs or equivalent means can be located adjacent to each other on small effective center distances to accommodate high-density electronic devices; furthermore, the present invention relates to combs that are used in conjunction with such springs or equivalent means, to create and to control the wiping or scrubbing action, which can promote good electrical connection. Moreover, the present invention uses such combs that are thermally matched to the electronic devices to improve the performance during thermal cycling procedures.

Growing community of inventors

Sun Valley, ID, United States of America

Gabe Cherian