Samsung Electro-mechanics Co., Ltd.

Ga Young Yoo

Mi Sun Hwang

Chang Hwa Park

Jun Hyeong Jang

Sang Ah Kim

Yu Rim Choi

A printed circuit board includes: an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer, and the first circuit layer includes a first region embedded in the insulating layer, and a second region protruding from the upper surface of the insulating layer.

Printed circuit board

A semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member including a first insulating layer disposed on the active surface of the semiconductor chip, a first redistribution layer disposed on the first insulating layer, first vias penetrating through the first insulating layer and electrically connecting the connection pads and the first redistribution layer to each other, and a first insulating film covering the first insulating layer and the first redistribution layer. The first insulating film includes a silicon based compound.

Growing community of inventors

Suwon-si, South Korea

Ga Young Yoo