Lg Innotek Co., Ltd.

Lg Electronics Inc.

Suzhou Lekin Semiconductor Co., Ltd.

Ga Yeon Kim

Koh Eun Lee

Hwan Hee Jeong

Min Ji Jin

Yon Tae Moon

Jae Joon Yoon

Eun Joo Kim

Yun Soo Song

Jung Hwan Son

Hui Seong Kang

Yeong June Lee

Nak Hun Kim

Jeong Uk Cha

Young Hyun Jeon

Yong Gil Shin

The present disclosure relates to a robotic cleaner. The robotic cleaner may be configured such that an imaginary plane passing mop contact portions having a small area passes through the center of gravity of the robotic cleaner, thereby travelling while the mops effectively scrub a floor surface.

Robotic cleaner

A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Semiconductor device package

According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.

Light-emitting device and lighting device having same

A semiconductor device package and a lighting device including a semiconductor device package are provided. The semiconductor device package may include a substrate, a first electrode module provided on the substrate, a light emitting device provided in a first region of the first electrode module, a second electrode module electrically disconnected from the first electrode module and provided on the substrate, and an insulating reflection layer provided on a circumference of the light emitting device between the first electrode module and the second electrode module and having a polygonal shape.

Growing community of inventors

Seoul, South Korea

Ga Yeon Kim