Skhynix Inc.

Ga Hyun No

Jin Su Park

Tae Ho Lee

In Chul Hwang

Yong Kim

Il Hwan Cho

Chan Woo Jeong

Kyung Hwan Cho

A semiconductor package may include a first chip stack, a second chip stack, and a third chip stack. The third chip stack may include third semiconductor chips, the third chip stack coupled to both of the first and second chip stacks.

Semiconductor packages including chip stacks

A semiconductor package includes a flexible package substrate including a first surface and a second surface, a metal post penetrating the flexible package substrate from the first surface toward the second surface and including a first protrusion that protrudes from the first surface and a second protrusion that protrudes from the second surface, a first semiconductor chip connected to the first protrusion, a second semiconductor chip connected to the second protrusion, a first flexible molding member covering the first semiconductor chip and the first surface of the flexible package substrate, a second flexible molding member covering the second semiconductor chip disposed on the second surface of the flexible package substrate, and an external connection terminal disposed on the second surface of the flexible package substrate.

Semiconductor packages with metal posts, memory cards including the same, and electronic systems including the same

A package substrate includes a substrate body and a plurality of patterns disposed on the substrate body. The substrate body has a first region including a chip attachment region and a second region adjacent to the first region. The plurality of patterns are disposed on the substrate body in the second region. Each of the plurality of patterns extends in a first direction to have a stripe shape, and the plurality of patterns are spaced apart from each other in a second direction which is substantially perpendicular to the first direction. Related fabrication methods, electronic systems and memory cards are also provided.

Package substrates, packages including the same, methods of fabricating the packages with the package substrates, electronic systems including the packages, and memory cards including the packages

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Seoul, South Korea

Ga Hyun No