Galileo Electro-optics Corporation

Center for Advanced Fiberoptic Applications

Robert J. Soave

G. William Tasker

Alan M. Then

Steven M. Shank

G William Tasker

Jerry R Horton

Alan M Then

Robert J Soave

Steven M Shank

Gregory L Snider

The invention is directed to continuous dynodes formed by thin-film processing techniques. According to one embodiment of the invention, a continuous dynode is formed by reacting a chemical vapor in the presence of a substrate at a temperature and pressure sufficient to result in chemical vapor deposition. In another embodiment, the layer is formed by liquid phase deposition and in another embodiment, the layer is formed by nitriding or oxidizing a substrate.

Method of making thin-film continuous dynodes for electron multiplication

The present invention discloses a method for constructing a completely micromachined MCP that is activated with thin-film dynodes wherein the interchannel regions are first dry etched in the substrate, resulting in channel pillars. The etched portions of the substrate are then back filled and the channel pillars are thereafter removed to produce a micromachined perforated microchannel plate. The technique may be employed to produce an active element for an integrated image tube or photomultiplier tube.

Method for fabrication of microchannel electron multipliers

A micromachined electron multiplier is disclosed wherein a substrate has at least one trench formed therein and an aperture cover is disposed on the substrate with at least one inlet aperture aligned with one end of the channel. Either the substrate or the apertured cover may have an outlet aperture formed therein. A variety of channel shapes, and arrays are disclosed as well as a solid state photomultiplier tube formed with an integrated radiation window and anode structure.

Micro-fabricated electron multipliers

Manufacture of a microchannel plate may be improved using photoelectrochemical etching and thin film activation such as CVD and nitriding and oxidizing wall surface portions of pores formed in the substrate. The pore pattern may be changed by oxidizing and etching the substrate prior to activation.

Fabrication of a microchannel plate from a perforated silicon

A continuous thin film dynode includes a substrate with at least one channel having a channel wall, an isolation layer overlying the channel wall, and a thin film overlying the isolation layer. The thin film includes a current carrying portion and an electron emissive portion overlying the current carrying portion. The electron emissive portion is essentially free of a material which is silica-rich, alkali-rich, and lead-poor. The current carrying portion is essentially free of a material which is lead-rich.

Thin film continuous dynodes for electron multiplication

A microchannel plate and method is disclosed. In a preferred embodiment the microchannel plate is a water of anisotropically etchable material having been subjected to a directionally applied flux of reactive particles against at least one face of the wafer in selected areas corresponding to microchannel locations. The flux removes material from the selected areas to produce microchannels in the wafer in accordance with the directionality of the applied flux.

Method of manufacturing microchannel electron multipliers

Microchannel plates (MCPs) and channel electron multipliers (CEMs) having channels etched by a directionally applied flux of reactive particles are disclosed. The channels are activated with thin film dynodes. Various embodiments including monolithic and stacked devices are disclosed. Activation of the channels is achieved by various techniques including CVD, LPD and native growth by oxidation.

Growing community of inventors

West Brookfield, MA, United States of America

G William Tasker