Leybold-heraeus Gmbh

Leybold Aktiengesellschaft

Demetron Gesellschaft Fuer Elektronik-werkstoffe M.b.h.

Demetron Gesellschaftfur Electronik-werstoffe Mbh

G A Siewert

Wolf-Dieter Munz

Horst Dietrich

Dieter Hoffman

Jorg Goebel

A process using a multiple-substance alloy having a gold content most preferably in the range of 94 to 98 percent by weight as a target in a cathode sputtering apparatus is disclosed. The alloy further contains non-gold elements of aluminum, copper and preferably an element of the group of Co, Ni, G, Ti, In, Cd, Sn, Fe and Pd.

Process and apparatus for sputter coating a gold alloy onto a substrate

A multiple-substance alloy used as a target in a cathode sputtering apparatus, and having a gold content most preferably in the range of 94-98 percent by weight, is disclosed. The alloy further contains non-gold alloys of aluminum, copper and preferably an element of the group of Co, Ni, Ga, Ti, In, Cd, Sn, Fe and Pd.

Multiple-substance alloy for targets of cathode sputtering apparatus

A multicomponent alloy for targets employed in the sputter coating of gold layers, said alloy having 35% to 55%, preferably either 50% or 42%, non-aurous alloy components.

Multicomponent alloy for sputtering targets

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Freigericht, Germany

G A Siewert