Osram Opto Semiconductors Gmbh

Günter Spath

Siegfried Herrmann

Herbert Brunner

Stefan Grötsch

Dominik Eisert

Michael Zitzlsperger

Simon Jerebic

Matthias Peter

Norbert Linder

David Racz

Kirstin Petersen

Daniel Leisen

Klaus Müller

Ewald Karl Michael Günther

Matthias Kiessling

Stephan Miller

Stefan GRÖTSCH

In an embodiment an optoelectronic component includes a radiation emitting semiconductor chip configured to emit primary electromagnetic radiation from a radiation emission surface, a conversion element configured to convert the primary electromagnetic radiation into electromagnetic secondary radiation, a first potting covering at least one side surface of the semiconductor chip, a second potting arranged on the first potting and an adhesion promoter with which the conversion element is fixed on the radiation emission surface of the semiconductor chip, wherein the adhesion promoter is arranged on a top surface of the first potting, wherein the first potting includes first filler particles, wherein the second potting includes second filler particles, and wherein a mass fraction of the first filler particles is greater than a mass fraction of the second filler particles per volume element.

Optoelectronic component, method for producing an optoelectronic component and lighting device

An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.

Optoelectronic component

The invention relates to an optoelectronic component, having &#x2014;a carrier () comprising a first main surface (Ia), &#x2014;at least one optoelectronic semiconductor chip () having no substrate, and &#x2014;a contact metallization (), wherein &#x2014;the carrier () is electrically insulating, &#x2014;the at least one optoelectronic semiconductor chip () is fastened to the first main surface (Ia) of the carrier () by means of a bonding material (), particularly a solder material, &#x2014;the contact metallization () covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (), and &#x2014;the contact metallization () is electrically conductively connected to the optoelectronic semiconductor chip ().

An optoelectronic module for emitting monochromatic radiation in the visible wavelength range is specified. The module has a plurality of light emitting diode chips which generate UV radiation. The UV radiation is converted into light in the visible range, for example, into green light, by a wavelength converter. The coupling-out of light from the module is optimized by the use of two selectively reflecting and transmitting filters. This module can be used as a light source in a projection apparatus.

Optoelectronic module and projection apparatus comprising the optoelectronic module

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Wuppertal, Germany

Günter Spath