Siemens Aktiengesellschaft

Infineon Technologies Ag

Günter Lang

Werner Kröninger

Werner Kroninger

Explained, inter alia, is a method in which a workpiece () to be processed is fastened to a work carrier () by means of a solid (). The work carrier () is made of a porous material, e.g. of porous ceramic. This processing method permits simple manipulation of the wafer during the processing. In addition, the workpiece () can be easily separated from the work carrier () using a solvent.

Work carrier and method of processing a workpiece

The novel process facilitates the production of very thin semiconductor chips with thicknesses down to a few .mu.m. The semiconductor chip is first of all arranged on contact surfaces, with the active side oriented toward the contact surfaces. The chip is then electrically connected to the contact surfaces via contact studs. Silicon is then removed from the exposed rear side of the semiconductor chip during a plasma etching process which has high selectivity with respect to the other materials.

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Nürnberg, Germany

Günter Lang