Boe Technology Group Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Fuyi Cui

Liang Zhang

Ang Xiao

Shanshan Bao

Quanqin Sun

Fashun Li

Xuefei Bai

Shixin Ruan

Lina Wang

Jingjing Chen

Xiangnan Wang

Xu Chen

Fujiang Jin

Zifeng Wang

Shuai Chen

Bing Li

Xuwei Li

Xuansheng Wang

Dan Jia

Zhiqiang Gao

Xueyong Zhang

Hyunchel Shin

Chunsheng Gu

Hyun Chel Shin

Xuewei Li

The application provides a sintering apparatus, a packaging system for an organic light emitting diode device and a sintering method, belongs to the technical field of organic light emitting diode device and can solve problems of long process time and high cost existed in the existing high temperature sintering process of organic light emitting diode device. The sintering apparatus comprises two sintering chambers capable of being communicated with each other, during operation, the substrate coated with glass cement is first placed into a sealed first sintering chamber to complete a first sintering process; then the substrate is placed into the second sintering chamber to complete a second sintering process. Thus, a time interval between the first sintering process and the second sintering process can be reduced, and no more nitrogen is wasted in transition from the first sintering process to the second sintering process.

Sintering apparatus, packaging system for organic light emitting diode device and sintering method

The present disclosure provides a display substrate and a method for manufacturing the same, and a display device. The display substrate includes a display area and an edge area surrounding the display area. The edge area is provided with bonding adhesive. The bonding adhesive is used to bond the display substrate and a counter substrate with which the display substrate is to be assembled together. A support structure is provided on the edge area and on a side of the bonding adhesive away from the display area. The support structure forms support between the display substrate and the counter substrate which have been assembled with each other.

Display substrate and method for manufacturing the same, and display device

A manipulator arm includes at least one arm body for carrying a to-be-carried object. The arm body is provided with a suction plate for sucking the to-be-carried object, and the suction plate is provided with a plurality of vacuum suction holes. The plurality of vacuum suction holes are uniformly distributed in the entire suction plate.

Manipulator arm, manipulator and carrying device

A printing screen method includes: providing at least one printing scraper assembly, wherein the printing scraper assembly has a printing scraper and a pressure sensing feedback system; placing at least one printing screen on a substrate; detecting and supplying a pressure value between the printing scraper and the printing screen during printing by the pressure sensing feedback system; and comparing the supplied pressure value and a predetermined pressure value, and changing the pressure between the printing scraper and the printing screen if a difference between the feedback pressure value and the predetermined pressure value is larger than a predetermined threshold. An imprinting apparatus implementing the printing screen method is also provided.

Screen printing method and imprinting apparatus

The present disclosure discloses a display panel motherboard, a method of manufacturing a display panel, and a display apparatus. The display panel motherboard includes a first substrate and a second substrate provided opposite to each other. The first substrate has a plurality of first zones and a plurality of second regions, each of the plurality of first zones has a first display region and a first packaging material pattern on a periphery of the first display region, each of the plurality of second zones has a second packaging material pattern, and the second packaging material pattern is at at least one side of the first packaging material pattern facing away from the first display region.

Display panel motherboard, method of manufacturing display panel, and display apparatus

An encapsulation structure and a related display apparatus are provided. The encapsulation structure includes a first substrate having a sealing region; a metal pattern on the sealing region; a thermal conductive layer, at least covering the metal pattern and electrically insulated from the metal pattern; and a sealing structure on the thermal conductive layer.

Encapsulation structure and display apparatus

The present disclosure relates to a display panel, a display device and a method for packaging a display panel. The display panel includes a substrate and a cover plate, wherein the substrate includes a display region and a packaging region located at a periphery of the display region, a glass adhesive is arranged between the substrate and the cover plate at a position corresponding to the packaging region, and a functional layer is arranged on the cover plate at a position corresponding to the glass adhesive, for reducing an intensity of laser irradiated on the glass adhesive during the sintering.

Display panel, display device and method for packaging display panel

A frame sealing glue includes a frame sealing glue body having an inner layer portion () and an outer layer portion (). The frame sealing glue further includes an intermediate film layer () disposed between the inner layer portion () and the outer layer portion (), and a plurality of enclosed spaces (P) are formed by the intermediate film layer () and the inner layer portion () or the outer layer portion () of the frame sealing glue body. A display panel and a display device are also provided. By means of the frame sealing glue, the display panel and the display device according to the embodiments of the present disclosure, it avoids a leakage phenomenon when the frame sealing glue is broken at different points, thereby increasing ability of the frame sealing glue for resisting external atmospheric pressure.

Frame sealing glue, display panel and display device

A sealing method of display panel, comprising: forming closed inner sealant layer in a sealing region of a first substrate; forming outer sealant layer which encloses the inner sealant layer, in which a communicating region is provided, the communicating region is configured to communicate a region between the inner sealant layer and the outer sealant layer and a region outside the outer sealant layer; affixing a second substrate to the first substrate in position to form a motherboard; and sealing the communicating region after cutting out the display panel from the motherboard. A display panel and a display device are also disclosed.

Method of sealing display panel, display panel and display device

A device for printing silicon sealant, including a coating device, a horizontal coating stage, and an elevating device, wherein: the elevating device is connected with the horizontal coating stage and is configured to adjust the height of the horizontal coating stage; the horizontal coating stage can be moved to a position right below a screen and fully contacted with the screen under the adjustment of the elevating device; and the coating device is configured to be moved to a position above the screen to coat silicon sealant in a pattern area of the screen after the horizontal coating stage is fully contacted with the screen.

Device and method for printing silicon sealant

An encapsulation method and an encapsulation device are provided. The encapsulation method comprises: forming a binding agent in an encapsulation region of a display substrate; forming an organic thin film on the binding agent; exerting a pressure on the organic thin film and the binding agent by using a pressure exerting device, wherein the organic thin film is not bound to the pressure exerting device; removing the organic thin film; and providing a cover plate on the binding agent and binding the cover plate with the display substrate by the binding agent.

Encapsulation method and encapsulation device

A packaging structure for an OLED device is provided. The packaging structure includes a plurality of films coated on an outer side of the OLED device and comprising alternately stacked inorganic layers and organic layers, wherein both a film in contact with the OLED device and a film farthest from the OLED device are inorganic layers, wherein the inorganic layer in contact with the OLED device comprises at least two sub-films sequentially stacked, and wherein a contact angle between i) a material for forming a sub-film of the at least two sub-films that contacts an organic layer and ii) an organic material for forming the organic layer is smaller than a preset angle.

Packaging structure for OLED device and display apparatus

The present disclosure provides a display panel and a fabricating method thereof, and a display device. The fabricating method for the display panel includes forming a glass adhesive layer on a packaging region of a first substrate, forming an OLED device on a display region of the first substrate, and aligning the first substrate with a second substrate, and forming a sealing structure between the first substrate and the second substrate by irradiating the packaging region with laser. The fabricating method for the display panel according to an embodiment of the present disclosure avoids the occurrence of the phenomenon that the coated glass adhesive layer and the evaporated organic light emitting layer are offset during the subsequent packaging process, by fabricating the glass adhesive layer on the substrate for forming the OLED device, thereby the production efficiency of the overall packaging process is enhanced.

Display panel and fabricating method thereof, and display device

An embodiment of the present disclosure discloses an evaporation method, including: providing a flexible substrate having an original size; stretching the flexible substrate to have an evaporation size, wherein, the evaporation size is greater than the original size; arranging a mask on a side of the flexible substrate having the evaporation size; evaporating a material onto the flexible substrate having the evaporation size by using the mask, to form a patterned film layer.

Evaporation method including stretching a flexible substrate

A printing screen and a sealant printing method are provided. The printing screen includes a frame, a mesh/screen fixed on the frame, and a film formed on the mesh. The portion of the mesh that is not covered by the film forms a feeding port in a rectangular ring shape. The rectangular ring includes two opposite first sides and two opposite second sides. The width of an upper opening of the cross section across the first sides is less than or equal to that of an upper opening of the cross section across the second sides. At a first height, the area of the cross section across the first sides is greater than that of the cross section across the second sides, the first height being less than the thickness of the film. The printing screen and the sealant printing method solve the problem of poor height uniformity of sealants.

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Beijing, China

Fuyi Cui