Tokyo Ohka Kogyo Co., Ltd.

Toyoko Kagaku Co., Ltd.

Tsuden Kabushiki Kaisha

Futoshi Shimai

Akihiko Sato

Tsutomu Sahoda

Hiroyoshi Sago

Shigemi Fujiyama

Junji Kutsuzawa

Hidenori Miyamoto

Koichi Nagasawa

Kenji Maruyama

Akira Uehara

Jun Koshiyama

Shigeru Kawata

Mitsuru Sato

Kimio Nishimura

Yasuhiro Numao

Hiroki Endo

Hideya Kobari

Takayuki Hirao

Tatekazu Hayashida

Kouji Harada

Hirotsugu Kumazawa

Hiroshi Okonogi

Yohey Omata

Hidehito Fukushima

Naomi Kawaguchi

Yoshihito Kai

[Problems] To easily and efficiently manufacture a catalyst layer having high catalytic activity and to easily manufacture a fuel cell having high power generation efficiency. [Solution] An apparatus for forming a catalyst layerfor a fuel cell on an electrolyte film (application object), the apparatus including: a holding portionthat holds a sheet-shaped electrolyte film, an application portionthat applies a catalyst inkfor forming the catalyst layeron at least one side of the electrolyte filmheld by the holding portion, a chamber portionthat is capable of forming a spaceincluding the holding portion, and a suction portionthat depressurizes the inside of the spaceformed by the chamber portionso as to dry the catalyst ink

Catalyst-layer forming apparatus

A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.

Substrate processing system, carrying device and coating device

Provided is a coating device including: a substrate carrying unit which rotatably holds a substrate while the substrate is upright and is able to dispose the held substrate at a first position and a second position; an application unit which includes a liquid material nozzle ejecting a liquid material to each of first and second surfaces of the substrate disposed at the first position; and a removal unit which includes an accommodation mechanism accommodating a part of the peripheral edge portion of the substrate disposed at the second position and a cleaning liquid ejection mechanism ejecting a cleaning liquid to the peripheral edge portion and removes the liquid material of the peripheral edge portion.

Coating device including substrate carrying, application and removal units

Substrate processing system, carrying device, and coating device

Provided is a coating device including: a rotating part which rotatably holds a substrate while the substrate is upright; a cup portion disposed to surround an outer periphery of the substrate held by the rotating part and having an opening which exposes a first surface and a second surface of the substrate; a coating part which includes a nozzle ejecting a liquid material to the first surface and to the second surface of the substrate through the opening; and a cover portion which is provided on the first surface and the second surface sides of the substrate and by which the opening is opened and closed.

Coating device

A coating device including a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state, and a nozzle managing mechanism which manages the state of the nozzles, in which the nozzle managing mechanism includes a soaking portion which dips the front end of the nozzle in a soak solution, and a discharging portion which discharges at least the soak solution, and a nozzle managing method.

Coating device and nozzle managing method

A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution.

Coating device and coating method

A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of a substrate while rotating the substrate; and an adjusting mechanism which adjusts the coating state of the liquid material at the outer periphery of the substrate; wherein the adjusting mechanism includes a dip portion which dips the outer periphery of the substrate in a solution while rotating the substrate and dissolves and removes a thin film formed on the outer periphery of the substrate; and a suction portion which suctions the vicinity of the outer periphery of the substrate after dipping in the solution.

A coating device includes a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state at a predetermined coating position, a carrying mechanism which carries the substrate between a substrate loading position, the coating position, and a substrate unloading position, and a dummy substrate holding mechanism which holds a dummy substrate at a holding position which is a position different from the substrate loading position, the coating position, and the substrate unloading position, and at which the carrying mechanism is allowed to connect with the dummy substrate.

Substrate processing system

The object of the present invention is to provide a cooling apparatus which makes it possible to cool a substrate uniformly in a short period of time even if the substrate has a large area. The cooling apparatuscomprises a flat-box-shaped body, a cooling medium supply tubewhich is inserted into the body, a nozzlewhich is attached to the cooling medium supply tubeso as to eject the cooling medium toward the internal surface of the body, a pipefor withdrawing water (refrigerant) ejected from the nozzletoward the body, a chillerfor cooling the water from the pipeto a predetermined temperature, and a circulating pipefor sending the water which has been cooled by the chillerback to the cooling medium supply tube

Cooling apparatus and substrate treating apparatus

A supporting pin which can cancel thermal expansion of a mounting table (hot plate) includes an upper supporting pin and a lower supporting pin, wherein the upper supporting pin and the lower supporting pin are independent of each other, the upper supporting pin is retained by the penetrating hole of the mounting table, and the lower supporting pin is attached to an elevator mechanism. Since the lower end of the upper supporting pin and the upper end of the lower supporting pin are in contact with each other, the operation of the supporting pin can be normally performed even when thermal expansion of the hot plate occurs.

Supporting pin

A heat treatment apparatus capable of ensuring a uniform temperature distribution on a substrate and reducing the generation of a sublimate includes a housing, a mounting table being arranged to move up and down within the housing, and a first heater being provided on the mounting table to heat a substrate placed on the mounting table, a second heater is provided on one side of the housing while an exhaust device is provided on the other side of the housing.

Heat treatment apparatus

A treatment solution supply apparatus capable of reducing an initial overshooting amount and ensuring a stable dispense characteristic even when treating a large amount of substrates as recycling a developing solution for a large amount of substrates includes a flow meter having an integration function in the vicinity of a nozzle and carries out feedback to the pump revolution frequency control in response to a variation of the flow meter, so that a fixed amount of a solution may be regularly discharged irrespective of the clogging level of a filter. Also, a developing solution can be stably dispensed on a resist coated film within a solution applicable range from a minimum value (film thickness of 1 mm) to a maximum value (3 mm).

Treatment solution supply apparatus

A nozzle for supplying a treatment liquid which makes it possible to perform uniform cleaning to a surface of a substrate even in a case where the size of a substrate is large. A slit-shaped ejection hole is formed at the lower end of the nozzle for supplying a treatment liquid. In the nozzle, a passage for supplying a treatment liquid which leads to the slit-shaped ejection hole is formed by bonding two nozzle parts to each other. Projections are provided on the abutting surface of at least one of the two nozzle parts so as to divide a treatment liquid flowing downward through the supply passage into left and right.

Nozzle for supplying treatment liquid and substrate treating apparatus

A slit nozzle which is easily manufactured and in which no capillary action occurs, and an apparatus for supplying a treatment liquid using the slit nozzle are disclosed. The slit nozzle is constructed of a left portion and a right portion joined to each other, one of which is made of metal and the other of which is made of resin. In the apparatus for supplying a treatment liquid using one or more of the slit nozzles, the slit nozzles are provided in a circulating passage of a treatment liquid whose temperature is controlled.

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Kanagawa, Japan

Futoshi Shimai