Fujitsu Corporation

Fujitsu Microelectronics Limited

Futoshi Fukaya

Shigeyuki Maruyama

Makoto Haseyama

Susumu Moriya

Naomi Miyaji

Masataka Mizukoshi

Kazuhiro Tashiro

Yuichi Asano

Yoshitsugu Katoh

Yoshinori Niwa

A mold includes a pot for accommodating resin, a cavity for accommodating a semiconductor chip to be resin-molded and a runner as a resin passage for transporting the resin accommodated in the pot to the cavity. A foreign matter retention pocket is disposed which is a recess formed by digging further a partial inner surface of the runner. A runner magnet attracts and attaches a metallic foreign matter contained in fluid transported in the runner to the inner surface of the foreign matter retention pocket.

Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method

A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.

Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device

An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor

A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.

Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor

A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

Semiconductor testing device

An IC to be tested having solder bumps is mounted on an IC socket mounted on a test board. The IC socket is provided with a contact unit including a plurality of straight contact pins each having an lower end connected to the test board and an upper end connected to the solder bumps and also including an elastic member for supporting the plurality of contact pins. A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of the plurality of solder bumps piercing an associated one of the solder bumps.

IC socket, a test method using the same and an IC socket mounting mechanism

Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage

A test board includes an insulating part provided to face a semiconductor device when the semiconductor device is mounted on the test board, a sloped connection hole formed in the insulating part for accepting a projection electrode when the semiconductor device is mounted on the test board, and a conductive part formed in the insulating part so as to be in contact with and electrically connected to the projection electrode. When the semiconductor device is mounted on the test board, the semiconductor device or the projection electrode is supported by the insulating part.

Test board and a test method using the same providing improved

A testing carrier has a flexible material such as a thin film employed as a supporting body which covers and thrusts a semiconductor device against a substrate. The substrate includes a plurality of contact terminals and a plurality of testing wiring patterns.

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Kawasaki, Japan

Futoshi Fukaya