Other

Futing Yi

Ming Pan

Quan Ke

An encapsulation method for a flip chip that includes electroforming metal on an electrode surface of a flip chip and a surface of an encapsulation substrate simultaneously. The encapsulation method specifically includes setting an encapsulation substrate around a flip chip; plating a metal conducting film on an electrode surface of the flip chip and a surface of the encapsulation substrate; coating a photoresist on a surface of the metal conducting film; aligning and photoetching an electrode structure on a photoetching plate and an electrode structure of the flip chip, and covering an insulating part between electrodes with the photoresist; taking the metal conducting film as the electrode, electroforming metal inside the photoresist structural model; and removing the photoresist covering the insulating part and removing the metal conducting film. The encapsulation method adopts electroforming and photoetching technology, and thus the process is simplified and the production efficiency is improved.

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Beijing, China

Futing Yi