Toppan Printing Co., Ltd.

Fusao Takagi

Hiroshi Matsuzawa

Shingo Akao

Osamu Koga

Satoshi Tanaka

Yusuke Onoda

Kiyotomo Nakamura

An electronic component includes a glass base in which through holes are formed passing through both surfaces thereof; an insulating resin layer laminated on each of both surfaces of the glass base and including a copper plated layer formed therein; and a capacitor including a lower electrode formed on the copper plated layer, a dielectric layer laminated on the lower electrode, and an upper electrode laminated on the dielectric layer. In the electronic component, the upper electrode has a region that is parallel to the copper plated layer and is formed so as to be smaller than a region of the dielectric layer parallel to the surface of the copper plated layer or a region of the lower electrode parallel to the surface of the copper plated layer.

Electronic component and method of producing electronic component

A metal photoetching product comprising at least one large cavity of minor axis WS, major axis WL and depth Din a surface of the product, wherein one or more cavities are included inside at least one of the at least one large cavity, and a smallest hole among the cavities has minor axis of WS, major axis WL, and depth D; and the product satisfies the following dimensions, D+D=plate thickness D, 0.02 mm&#x2266;D&#x2266;2 mm, 0.4&#xd7;D&#x3c;WS&#x3c;D, and 0.2&#xd7;D&#x3c;WS&#x3c;0.8&#xd7;D.

Metal photoetching product and production method thereof

A metal photoetching product comprising at least one large cavity of minor axis WS, major axis WL and depth Din a surface of the product, wherein one or more cavities are included inside at least one of the at least one large cavity, and a smallest hole among the cavities has minor axis of WS, major axis WL, and depth D; and the product satisfies the following dimensions, DDplate thickness D, 0.02 mm&#x2266;D&#x2266;2 mm, 0.4&#xd7;D&#x3c;WS&#x3c;D, and 0.2&#xd7;D&#x3c;WS&#x3c;0.8&#xd7;D.

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Kitakatsushika-gun, Japan

Fusao Takagi