Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

The Japan Carlit Co., Ltd.

Kanto Koatsu

Fusaji Shoji

Fumio Kataoka

Hitoshi Yokono

Haruhiko Matsuyama

Ryoichi Sudo

Tokio Isogai

Issei Takemoto

Takashi Inoue

Eiji Matsuzaki

Hideo Sotokawa

Isao Obara

Takeshi Watanabe

Toshimasa Ishigaki

Hitoshi Oka

Hidetaka Shigi

Hideo Arima

Susumu Era

Tetsuya Yamazaki

Yasuhiko Uehara

Etsuji Iwami

Naoya Kitamura

Hisashi Kohkame

Hideyasu Murooka

Masayuki Kyooi

Hirohumi Izumi

Ryo Suzuki

Kazuo Suzuki

Jun Tanaka

Naoki Matsushima

Naoki Koyama

Hiroyoshi Kokaku

Masatoshi Takeshita

Koji Suzuki

Nobuyuki Ushifusa

Tetsuo Tajima

Kenkichi Suzuki

Tsuyoshi Fujita

Daisuke Makino

Asao Isobe

Nobuo Aoki

Akio Fujiwara

Hiroshi Umezaki

Shigeru Koibuchi

Seiichi Tsuchida

Mitsumasa Kojima

Shousaku Ishihara

Shunichiro Kuwatsuka

Hidetaka Satou

Akihiro Kenmotsu

Michio Ooue

Nobuhito Katsumura

Shiyuki Sakaue

Teruo Takai

Teruki Aizawa

Takeshi Komaru

Tsuyoshi Aoyama

Koichi Kakefuda

Kiyoyuki Suzue

Kenji Sugimoto

Kyoko Amemiya

Makoto Kobata

Ken Nanaumi

Mitumasa Kojima

Mithumasa Kojima

Shunichiro Kuwazuka

Teruji Aizawa

Jun Kurita

Toshiyuki Kiriyu

Yoshinori Matsuzaki

Masayoshi Kitadani

Kouji Oikawa

Mitsuo Yoshimoto

Atsushi Honda

Shozi Ikeda

Shirou Akamatsu

Shogi Ikeda

Miharu Otani

Madoka Kinoshita

Koiti Kakefuda

Hisashi Kogame

Tatsuo Ito

In order to reduce the address voltage in a gas discharge type display pane, the address electrodes in the display panel are formed on the barrier ribs. Further, a fluorescent layer is coated on the wall surface of the barrier ribs thereby suppressing erroneous light emission or degradation of the fluorescent layer during address discharge.

Gas discharge display panel having address electrodes located on second

A multilayer ceramic substrate comprising at least one ceramic layer made by laminating at least one ceramic green sheet layer and conductor layers formed on surfaces of the at least one ceramic green sheet layer into laminates and by sintering the resulting laminates. Each ceramic green sheet layer comprises a ceramic precursor composition comprising (I) 100 parts by weight of ceramic fine powder having an average particle diameter of 10 microns or less as component (C) and (II) 5 to 30 parts by weight, based on 100 parts by weight of the ceramic fine powder, of an organic binder for bonding the ceramic fine powder. The organic binder comprises (i) 100 parts by weight of a water insoluble polymer of at least one vinyl monomer as a major component of the organic binder, as component (A), and (ii) 1 to 9.5 parts by weight, based on 100 parts by weight of the component (A), of water soluble polymer as component (B). In the binder particles of the component (A) being dispersed by the component (B) in an aqueous medium resulting from suspension polymerization of the at least one vinyl monomer in water containing the water soluble polymer as a dispersion stabilizer.

Organic binder for shaping ceramic, its production method and product

This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.

Wiring structure with metal wiring layers and polyimide layers, and

The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).

Wiring structures and method of manufacturing the same

A metalization structure uses a surface protective film formed of a polyimide that is produced by heating and dehydrating polyimide precursor has its molecular chain composed of recurring units represented by the following general formula (1) and recurring units represented by the following general formula (2): ##STR1## (where R.sup.1 is at least one tetravalent organic group selected from among ##STR2## R.sup.2 is at least one divalent organic group of a linear structure as selected from among ##STR3## and R.sup.3 is a divalent organic group of a crooked structure that has at least two aromatic rings).

Polyimide precursor, polyimide and metalization structure using said

A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.

Process for fabricating an interconnected multilayer board

Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

Interconnected multilayer boards and fabrication processes thereof

Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.

Heat-resistant bonding materials

The present invention provides a polyimide having all of small dielectric constant, small thermal expansion coefficient, high heat resistance, high glass transition temperature and high mechanical properties, a precursor of the polyimide, and processes for producing them. A polyimide precursor whose molecular chain comprises repeating units represented by the following general formula (1) and repeating units represented by the following general formula (2): ##STR1## wherein R.sup.1 is at least one kind of tetravalent organic group selected from the group consisting of ##STR2## R.sup.2 is at least one kind of divalent organic group having a linear structure which is selected from the group consisting of ##STR3## m is an integer of 1 to 4, and R.sup.3 is a divalent organic group having a non-linear structure which contains at least two aromatic rings.

Polyimide precursor, cured product thereof, and processes for producing

This invention relates to insulated wires having good heat resistance and solderability. In particular, wires coated with a polyimide resin or an imide-modified polyurethane resin are provided. They can each be produced by coating a conductor with an insulating coating composition which contains a polyamic acid represented by the following formula: ##STR1## wherein R.sup.1 means a particular tetravalent organic group, R.sup.2 denotes a specific divalent organic group, X is an alkylene or alkylenephenylene group, and n stands for a positive integer.

Insulating coating composition, solderable insulated wires, production

A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.

Multilayer wiring substrate and production thereof

A method for making a cathode ray tube involves the step of positioning a non-reflective transparent plate in front of a face plate of a tube body with a given space therebetween; a step of filling the space with a resin composition and a step of heating the resin composition filled in the space to harden the composition to bond the tube body and the non-reflective transparent plate to each other. The resin composition is an unsaturated polyester resin composition which comprises an unsaturated polyester having a molecular weight per one unsaturated group of 1000 to 8000 and (1) a polymerizable monomer, a low-temperature hardener and a high-temperature hardener or (2) styrene and/or a derivative thereof and an unsaturated compound having a refractive index of 1.5 or less. This composition can be molded in a short time and forms no strain on hardening and serves as an adhesive for production of the cathode ray tube.

Method for making a cathode ray tube

Highly pure 3,3',4,4'-biphenyltetracarboxylic acid (BPTA) and dianhydride thereof (BPDA) are produced by heating crude BPTA to give BPDA, treating the BPDA with hot water to give highly pure BPTA, and in the case of highly pure BPDA, heat treating the pure BPTA to give highly pure BPDA.

Process for producing highly pure 3,3',4,4'-biphenyltetracarboxylic acid

Disclosed is an unsaturated polyester resin composition which comprises an unsaturated polyester having a molecular weight per one unsaturated group of 1000 to 8000 and (1) a polymerizable monomer, a low-temperature hardener and a high-temperature hardener or (2) styrene and/or a derivative thereof and an unsaturated compound having a refractive index of 1.5 or less. This composition can be molded in a short time and forms no strain on hardening and is suitable as an adhesive for production of cathode ray tubes.

Unsaturated polyester resin composition for cathode ray tube and its use

A thin film magnetic head of which the insulation layer is made of a polyimide resin obtained by heat-curing a polyimide precursor represented by the following general formula (I) or (II) or a mixture thereof not only has excellent characteristics with respect to the insulation layer, i.e. satisfactory flatness, high glass transition temperature and excellent adhesiveness but also is free from film defects, i.e., exhibits high reliability: ##STR1## wherein R is, e.g., ##STR2## Ar.sup.1 is, e.g., ##STR3## Ar.sup.2 is, e.g. ##STR4## n is an integer of 1 to 100, and m is an integer of 10 to 500.

Thin film magnetic head

Growing community of inventors

Yokohama, Japan

Fusaji Shoji