Fujitsu Corporation

Fumiyuki Takahashi

Hiroyuki Tsukahara

Takashi Fuse

Yoshitaka Oshima

Youji Nishiyama

Tetsuo Koezuka

An apparatus includes a processor that matches of local-feature-amounts in a state where an image of a measurement target captured by an image-sensor and a projective-transformed image of three-dimensional design data of the measurement target substantially overlap each other on a display to search the captured image and a virtual image generated from the projective-transformed image for a plurality of feature-point pairs with similar local-feature-amounts of an image, estimates a temporary-external-parameter related to a position and orientation of the image-sensor, compares an initial-external-parameter and the temporary-external-parameter to diagnose reliability of the temporary-external-parameter, and selects, among the feature-point pairs, a specified number of feature-point pairs with a score value indicating similarity between two feature-points forming each feature-point pair equal to or higher than a threshold value, estimate a final-external-parameter using the selected feature-point pairs, and display the captured image and the projective-transformed image in a superimposing manner using the external-parameter.

Measurement apparatus, measurement method, and computer-readable recording medium storing measurement program

An information processing apparatus includes a processor and a memory. The memory stores three-dimensional data describing a real device including an object, a source of an acting factor that acts on the object and causes a detectable change at the object, and a detector that detects the change in a specified detection range. The processor produces a virtual device that represents the real device in a virtual space, based on the three-dimensional data in the memory. With this virtual device, the processor simulates the change caused by the acting factor, and calculates a region of the object in which the simulated change satisfies a specified condition.

Information processing apparatus and method for calculating inspection ranges

A candidate pixel generating unit searches a path-undetermined adjacent pixel j which is adjacent around a parent pixel i, and, with respect to the searched adjacent pixel j, generates a candidate pixel having data {j(i,|Wij|)} in which the parent pixel i and magnitude |Wij| of a phase difference Wij in which phase skip between the pixels is corrected are combined. The registration control unit registers the pixel to a heap having a function of ordering the registration order, and order the pixel, if the weight |Wij| is equal to or more than a predetermined threshold value TH; and registers the pixel to a queue not having the function of ordering the registration order if it is less than the threshold value TH. A path determination unit prioritizes the queue to retrieve and eliminate one candidate pixel, and determines a path between the eliminated candidate pixel and the parent pixel.

Phase unwrapping method, program, and interference measurement apparatus

A reference-height calculating unit calculates an original height of a distortion detecting mirror when a distortion detecting mirror and a reference mirror are set in parallel to each other. A height measuring unit measures mirror heights when the distortion detecting mirror is tilted in directions of an X axis and a Y axis. A contour-line calculating unit calculates a pair of contour lines based on the mirror heights. An intersection calculating unit calculates an intersection of the contour lines. A storing unit stores coordinates to which height of predetermined coordinates are moved by distortion in a correction table. A distortion correcting unit corrects the distortion based on the correction table.

Optical-distortion correcting apparatus and optical-distortion correcting method

A method of inspecting bumps provided on a surface of an object to be inspected includes the steps of: (a) irradiating a first irradiation beam on said object in an oblique direction and (b) imaging a first reflected beam from said object so as to obtain a first reflection image including a first reflection region and a height data of said bump corresponding to said first regular reflection region produced by a part of the first reflected beam reflected near an apex of the bump. The method further includes the steps of (c) shifting a position of said first regular reflection region in said first reflection image in accordance with a value derived from said height data and said predetermined angle, (d) extracting said first regular reflection region within a predetermined region from said first reflection image after said step c), and (e) detecting a height of said bump based on said height data corresponding to the extracted first regular reflection region. Also disclosed is an apparatus for performing the disclosed method.

Method and apparatus for inspecting bumps and determining height from a regular reflection region

The bump height is measure din a sample area on a wafer, the bump height distribution on the wafer is estimated on the bases of the measured value, the portion where the estimated height distribution is out of a predetermined range is determined as an inspection area, and the bump height is measured in the inspection area, and a chip area having a bump height out of a predetermined range is judged to be defective. Data of the inspection areas and inspection results are accumulated, and the inspection density is renewed on the basis of the accumulated data. In another method, the inspection area is divided into rectangular blocks so that each block has a width of approximately equal to a light beam scanning length and a distance between any adjacent bumps in the feeding direction is less than a predetermined value, feeding path being perpendicular to the scanning direction. Block feed time and between-block feed time are calculated, a whole feeding path whose total feed time of the block and between-block feed time are minimum is found, and bump height is measured with receiving reflected light from the bump while feeding along the found feeding path.

Method and apparatus for visual inspection of bump array

The object of the present invention is to provide a height measurement device that can accurately measure the height of an object to be measured, and that can easily and precisely adjust the focal point of an optical system. According to the present invention, a height measurement device, which forms an image of a light point generated by a light source on a surface of a measured object via an irradiation side focusing lens, which forms an image of the formed image of the light point on a light point position detector via a light reception side focusing lens, and measures a height of the measured object according to the light point position on the light point position detector, comprises: a stage perpendicularly movable with the measured object mounted thereon; a camera for obtaining a light point image formed on a target face on the stage; and a controller for detecting a position of the stage or of the radiation focusing lens as a focal point, at which a light quantity on a predetermined pixel in the light point image obtained by the camera becomes a maximum level, while moving the stage or the irradiation side focusing lens.

Height measurement device and height measurement method

The present invention is a method for inspecting height, scanning the surface of a subject item having zones of different reflectance with incident light of a prescribed intensity, causing the reflected light from the surface to be imaged with means for detecting light spot positions, and detecting the height of said surface from the light spot position which was imaged, said method comprising: a step of scanning, in a second zone with low reflectance surrounding a first zone with high reflectance with a first intensity of incident light, which is low to the degree that said means for detecting light spot positions is not saturated even with said high reflectance; and a step of scanning, if it is detected that the quantity of light of the imaged light of said reflected light exceeds a prescribed threshold value, with an appropriate second intensity of incident light found from said intensity of incident light and said detected quantity of light at the time of the preceding scan.

Growing community of inventors

Kawasaki, Japan

Fumiyuki Takahashi