Mitsubishi Denki Kabushiki Kaisha

Fumiyuki Miyamoto

Seiji Oka

Hiroyuki Nakajima

Eiki Jidai

Masakazu Murayama

Takashi Masuda

Daigo Takemura

Kenro Mitsuda

Kazuki Kubo

Tetsuo Mitani

Yoshiyuki Takuma

Hirofumi Fujioka

Yoshinori Shirafuji

Takashi Takahama

Shinobu Ogasawara

Makoto Doi

Yasushi Akahori

Yasushi Yamamoto

Mitsuhiro Nonogaki

Yukio Hidaka

Hitoshi Tokuyama

Toshio Isooka

Yoshihiro Maruyama

Hiroyukio Nakajima

A porous electrolytic solution reservoir which is capable of being impregnated with an electrolytic solution is provided in an exterior case so as to make contact with a separator. The average diameter of the pores in the electrolytic solution reservoir is greater than the average diameter of pores in the separator. The electrolytic solution reservoir is impregnated with a predetermined amount of electrolytic solution, so that the occupation ratio of electrolytic solution within the pores in the separator becomes 50% or more when fully charged, and the occupation ratio of electrolytic solution within the pores in the electrolytic solution reservoir becomes 100% or less when fully discharged.

Electric double layer capacitor

A process for producing a hermetic electric compressor for a refrigerating or air-conditioning apparatus using a refrigerant having a hydrofluorocarbon base which comprises a motor unit, a compressing unit driven by the motor unit and a sealed housing enclosing the motor unit and the compressing unit and stores a refrigeration oil on the bottom of the sealed housing, wherein a solventless varnish comprising a thermosetting resin having at least two (meth)acryloyl groups in one molecule, a low-viscosity vinyl or 1-alkylvinyl monomer having an ether or ester linkage as a reactive diluent and an organic peroxide as a reaction initiator is used as an insulating varnish to insulate and fix the magnet wires of the stator of the motor unit, and the solventless varnish is cured by heating at a temperature of from 153 to 180.degree. C. for from 0.5 to 3.5 hours.

Process for producing a hermetic electric compressor

A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.

Composition of polyepoxy compounds, linear polymer and aromatic diamine

A resin having a low dielectric constant obtained by heat-curing 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain and from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule in the presence of an organic peroxide. Also disclosed is a resin having flame resistance obtained by heat-curing a blend of an organic peroxide with a composition comprising 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain, from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule and at least one member selected from the compounds of the formulas I-IV: ##STR1## wherein X is H or CH.sub.3, Y is Br or Cl, A is --, --o--, --CO--, SO.sub.2, --CH.dbd.CH--, --C(CH.sub.3).sub.2 --or --(CH.sub.2 .sub.a --, ad each of m, n and a is an integer of from 1 to 4, in an amount of from 25 to 100 parts by weight in the case of the formulas I to III and from 25 to 200 parts by weight in the case of the formula IV.

Electrical insulating resin

An epoxy impregnating resin composition comprising 100 parts by weight of a compound having at least two epoxy groups in one molecule, from 0.1 to 100 parts by weight of an allyl epoxy compound having both allyl and epoxy groups in one molecule and represented by the general formula: ##STR1## where R is hydrogen, halogen or a monovalent organic group, from 30 to 300 parts by weight of a liquid cyclic acid anhydride, and from 5 to 300 parts by weight of a compound having a polymerizable double bond.

Epoxy impregnating resin composition

A thermosetting resin composition, consists essentially of:

Thermosetting resin composition

A thermosetting resin composition, which is characterized by mixing 5 to 300 parts by weight of tri-functional vinyl monomer and 0.1 to 10 parts by weight of phenoxy resin with respect to 100 parts by weight in total of an epoxy compound containing in its molecule at least two epoxy groups and a curing agent for said epoxy compound.

Growing community of inventors

Tokyo, Japan

Fumiyuki Miyamoto