Hitachi Maxell, Limited

Fumiyuki Inose

Wasao Takasugi

Satoshi Kawamura

Shin Shimizu

Toshiyuki Kaneko

An information input/output unit according to the present invention includes a receiving cavity capable of accommodating therein two different species of noncontact information media having shapes differing from each other and an antenna part capable of performing communication by radio with the noncontact information media. The unit can communicate with a close-fit-type noncontact information medium without fail and preferably with predetermined degree of freedom for the shapes of the media.

Information input/ output unit

In a non-contact IC (integrated circuit) module having an IC chip and a coil, the non-contact IC module communicates with a terminal via a booster unit. A communication system extends a communication distance of data modulated by using a carrier frequency (sub-carrier frequency). A communication auxiliary apparatus is used in a communication between a non-contact information medium and an external appliance.

Non-contact information medium and communication system utilizing the same

The container and the management system include a storage portion to accommodate an expendable product to be used by an apparatus; and a memory to store identification information that can be read out by an external device; wherein the container is removably installed in the apparatus and the apparatus retrieves expendable product identification information and remaining amount information from the container to determine if the expendable product is an appropriate one.

Accommodating enclosure and management system

A compact noncontact communication semiconductor device having a multidirectional or omnidirectional antenna and usable in a minuscule space to which the applications have conventionally been difficult is provided. The outer peripheral portion of a spherical IC is covered with an insulating layer having a thickness equal to or larger than the diameter of the IC , and antenna patterns are formed on the surface of the insulating layer . The antenna patterns can be configured either with a winding or by microprocessing using etching or laser beam, for example, for the conductive film formed on the surface of the insulating layer . The antenna patterns and the circuit pattern formed on the surface of the IC are interconnected via a through hole

Growing community of inventors

Tokorozawa, Japan

Fumiyuki Inose