Seiko Epson Corporation

Fumiya Maeda

Setsuya Iwashita

Yasutoshi Hideshima

Shunsuke Uchizono

Koichi Ozaki

Tadao Fukuta

Tetsuhiko Takeuchi

A thixomolding material includes: a metal body containing magnesium(Mg) as a primary component; a plurality of coating particles provided at a front surface of the metal body and having an average particle diameter equal to or less than 100 μm, the plurality of coating particles being made of an inorganic material differing from the metal body; and an interposed particle interposed between the metal body and the coating particles and having an average particle diameter smaller than the coating particle, the interposed particle being made of an inorganic oxide.

Thixomolding material and method of manufacturing thixomolding material

Provided is a thixomolding material including a metal body that contains Mg as a main component, and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.

Thixomolding material

A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.

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Azumino, Japan

Fumiya Maeda