Ushio Denki Kabushiki Kaisha

Fumitoshi Takemoto

Shinji Suzuki

Kenichi Hirose

Tatsushi Igarashi

Nobuyuki Hishinuma

Hiromitsu Matsuno

Kunio Kasagi

Makoto Wasamoto

Motohiro Sakai

Yoshinori Aiura

Masashi Okamoto

Tatsumi Hiramoto

Takashi Asahina

Yasuo Oonishi

Yasuhiko Wakahata

Jun Murase

Hiroaki Tokai

Hiroshi Sugawara

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

Method of bonding substrates, microchip and method of manufacturing the same

A curing process of an ultraviolet curable paint by which a paint cured layer can be formed on an object to be processed without needing a long time, and intended color can be obtained of the object to be processed on which the paint cured layer is formed. The curing process of an ultraviolet curable paint is one for curing an ultraviolet curable paint through an ultraviolet irradiation step of irradiating a surface of an object to be processed to which the ultraviolet curable paint is applied with ultraviolet rays from an ultraviolet radiation unit. The ultraviolet curable paint is not sensitive to light of not less than 380 nm in wavelength but sensitive to light of less than 380 nm in wavelength. The ultraviolet radiation unit radiates ultraviolet rays having a peak wavelength within a range of not greater than 350 nm in wavelength.

Curing process of ultraviolet curable paint

An object of the present invention is to provide a method of joining resin tubes, in which the degree of freedom of selecting a tube material is large, and further a defect such as stiffness and contraction at joining portions of the tubes is not developed. The method of joining resin tubes according to the present invention is a method of joining resin tubes so that a first tube is joined to a second tube, the first tube and the second tube each being made of synthetic resin, the method comprising: a surface activation step of activating each of a joining region of the first tube and a joining region of the second tube; and an adhesion step of adhering the joining region of the first tube obtained via the surface activation step with the joining region of the second tube obtained via the surface activation step to each other.

Method of joining resin tubes

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

Method of bonding substrates and method of producing microchip

An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein. The process for laminating works together laminates a work composed of a resin to a work composed of a resin or glass, the process including a surface activation step of treating a laminating surface of at least the work composed of a resin with vacuum ultraviolet ray or with atmospheric pressure plasma, and a bonding step of bonding together the two works stacked on each other such that a laminating surface of one of the works abuts a laminating surface of the other work, wherein in the surface activation step, the treatment of the laminating surfaces with vacuum ultraviolet ray or with atmospheric pressure plasma is terminated when an accumulated treatment quantity of the vacuum ultraviolet ray or the atmospheric pressure plasma applied to the laminating surfaces is within an initial drop range shown in a variation curve of a water contact angle on the laminating surfaces with respect to the accumulated treatment quantity.

Process for laminating works together

A light source apparatus is adapted to be shared by excimer lamps. An IC tag is disposed at each lamp, and the IC tag stores information identifying the lamp. A storage unit of the light source apparatus stores information identifying a usable lamp (or usable lamps) for the light source apparatus, an emission wavelength of the lamp, and a sensitivity correction value of an optical sensor that corresponds to the emission wavelength. When the light source apparatus is driven to cause the lamp to light, the information stored in the IC tag and information stored in the storage unit are collated and it is determined whether the lamp is usable and the emission wavelength of the lamp is a preset emission wavelength. If it is determined that the lamp is usable and the emission wavelength is appropriate, the sensitivity of the optical sensor is corrected with the correction value.

Light source apparatus

A light source device in which the radiated light from the dielectric barrier discharge lamp can always be stabilized even if the discharge vessel of the dielectric barrier discharge lamp is large or the load on the tube wall within the discharge vessel is small. This is achieved according to the invention by the provision of a light source device having a discharge lamp which has a generally cylindrical, coaxial double-tube arrangement of an outer tube and an inner tube, in which there is an outer electrode on the outer tube, in which there is an inner electrode on the inner tube, and in which a discharge space between the inner and outer tubes is filled with a discharge gas for formation of excimer molecules by a dielectric barrier discharge, and of a power source for operating this discharge lamp in accordance with the relationship: Vs/Vp.ltoreq.0.5 where Vs is the starting voltage and Vp is the voltage applied to the discharge lamp during steady-state luminous operation.

Light source device using a double-tube dielectric barrier discharge

To maintain the relative positional relationship between an inner tube and an inner electrode of a dielectric barrier discharge tube having a roughly cylindrical, double tube arrangement of an outer tube coaxially arranged about an inner tube with a discharge space defined therebetween, an outer electrode on an outer surface of the outer tube, an inner electrode on an inner surface of the inner tube, and a discharge gas which forms excimer molecules by a dielectric barrier discharge filling said discharge space, despite repeated expansion and contraction of the inner electrode due to the dielectric barrier discharge lamp being repeatedly turned on and off, according to the invention, the inner electrode is formed of a substantially tubular metal component or the like, and a motion preventing component is provided at opposite ends of the inner electrode for maintaining an axial position of the inner electrode relative to the inner tube.

Dielectric barrier discharge lamp

A dielectric barrier discharge lamp having a generally cylindrical double-tube arrangement of an outer tube coaxially disposed about an inner tube, with an outer electrode disposed on an outside surface of the outer tube, an inner electrode disposed on an inside surface of the inner tube, and a discharge space provided between the outer tube and the inner tube which is filled with a discharge gas for formation of excimer molecules by dielectric barrier discharge achieves firm engagement of the inner electrode against the inner tube and a stable discharge over a long time even if part of the electrode corrodes due to the ozone produced or it wears. This is achieved by embodiments in which the inner electrode is a generally tubular part which is slit in an axial direction along the full length thereof. The tubular part can be a single cylindrically sheet having opposite longitudinally extending edges spaced from each other by a gap or overlapped. Alternatively, the tubular part can be formed of a pair of substantially semi-cylindrical parts which are separated by a gap between each pair of longitudinally extending edges.

In a dielectric barrier discharge lamp, in which a discharge vessel, in which a discharge gas forming 'excimer' molecules is encapsulated, is provided with a dielectric provided with a netlike electrode and a window, through which the light goes, the first object of the invention is achieved by an arrangement in which a thickness of ends of the above-described netlike electrodes is greater than the average thickness of the entire electrode. Another object of the invention is achieved by an arrangement in which a holder incorporated in the discharge vessel has an outer dimension that is less than/equal to an outer dimension of the netlike electrodes. A further object of the invention is achieved by an arrangement by which the discharge vessel has a hollow cylindrical shape formed from an external tube and an internal tube and a means for hermetic sealing is arranged inside the internal tube.

Growing community of inventors

Tokyo, Japan

Fumitoshi Takemoto