Ebara Corporation

Fumitoshi Oikawa

Koichi Fukaya

Mitsuru Miyazaki

Tomoaki Fujimoto

Tomoatsu Ishibashi

Takuya Inoue

Teruaki Hombo

Shinji Kajita

Koji Atoh

Naoki Matsuda

Kenya Ito

Hideaki Tanaka

Yasuyuki Motoshima

Mitsuhiko Shirakashi

Hiroshi Sotozaki

Xinming Wang

Hisajiro Nakano

Yohei Eto

Koji Ato

Haruko Ono

A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.

Substrate cleaning apparatus and substrate cleaning method

A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

Cleaning apparatus and polishing apparatus

A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

Substrate cleaning apparatus and cleaning method of substrate

An apparatus for cleaning a substrate has a holding unitthat holds a substrate W; a rotated unitconnected to the holding unit; a rotating unitthat is provided on a peripheral outer side of the rotated unitand rotates the rotated unit; and a cleaning unitthat physically cleans the substrate W held by the holding unit

Apparatus for cleaning substrate and substrate cleaning method

A substrate is cleaned by performing a scrubbing process on a surface to be cleaned of the rotating substrate with a roll-shaped cleaning member while holding an outer circumferential surface of the roll-shaped cleaning member in contact with the surface to be cleaned of the substrate across a predetermined contact width. During at least a part of the scrubbing process, the roll-shaped cleaning member is placed at an offset cleaning position where the central axis of the roll-shaped cleaning member is spaced from the central axis of the substrate by a distance which is 0.14 to 0.5 times the contact width. The surface to be cleaned of the substrate is scrubbed with more uniform cleaning intensity while taking into account the cleaning intensity at each position (area) along the radial direction of the surface to be cleaned of the substrate.

Method and apparatus for cleaning substrate

Roller shaft for semiconductor cleaning

A substrate processing apparatus includes: a polishing deviceA for polishing the surface of a substrate; and at least one of an ultrasonic cleaning devicefor cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning devicefor cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid. A substrate processing method includes: a polishing step of polishing the surface of a substrate; and a solid matter noncontact cleaning step of cleaning the surface of the substrate by spraying a liquid to the surface of the substrate. The above apparatus and method make it possible to efficiently clean the surface of a substrate after it is polished.

Substrate processing apparatus and substrate processing method

A substrate cleaning apparatus allows an end face and/or a bevel face of a substrate to be scrub-cleaned in a simple and effective manner. The apparatus has a plurality of rotatable substrate rotating rollers for gripping a periphery of the substrate and rotating the substrate, a cleaning roller capable of rotating and having a cleaning member which is to be brought into contact with the end face and/or the bevel face of the substrate so as to apply scrub-cleaning to the end face and/or the bevel face, and a power transmission mechanism for transmitting a rotating force of the substrate rotating roller to the cleaning roller so as to rotate the cleaning roller.

Substrate cleaning apparatus

A cleaning apparatus for cleaning a substrate includes a cleaning member, a cleaning member carrier for holding the cleaning member and bringing the cleaning member into contact with a substrate to be cleaned, and a sensor for detecting a presence/absence of a cleaning held by the cleaning member carrier. The substrate is cleaned by causing relative movement between the cleaning member and the substrate while keeping the cleaning member and the substrate in contact with each other.

Substrate cleaning apparatus and cleaning member

A cleaning device for use in a substrate cleaning apparatus is disclosed. The cleaning device includes a cleaning member brought into contact with a surface of a substrate to be cleaned, and a cleaning member holding mechanism for holding the cleaning member. The cleaning member holding mechanism includes a holding member (sleeve) having a lower portion split into a plurality of chuck jaws, and a ring member fitted onto the outer periphery of the holding member. An end portion of the cleaning member is inserted into an insertion hole formed by the chuck jaws, and the ring member is fitted onto the outer periphery of the holding member, thereby holding the cleaning member with the chuck jaws. That is, the cleaning member holding mechanism has a collet chuck structure.

Cleaning device and substrate cleaning apparatus

The present invention relates to a substrate cleaning apparatus, and more particularly to a substrate cleaning apparatus suitable for cleaning a substrate which requires a high level of cleanliness, such as a semiconductor wafer, a glass substrate, a liquid crystal panel, etc. The substrate cleaning apparatus comprises a substrate holder for holding a substrate while rotating the substrate in a substantially horizontal plane, a cleaning device for scrubbing a surface to be cleaned of the substrate, a cleaning device holder for holding the cleaning device rotatably about its own axis, the cleaning device having a shaft and a cleaning member disposed around the shaft, the cleaning member being permeable to a cleaning liquid, the shaft having an axially extending shaft hole and a cleaning liquid ejection port extending radially therethrough from the shaft hole, and a fluid-lubricated bearing disposed between the shaft and the cleaning device holder in at least one end thereof and lubricated by a cleaning liquid as a lubricating fluid.

Growing community of inventors

Tokyo, Japan

Fumitoshi Oikawa