Mitsui Petrochemical Industries, Ltd.

Yazaki Corporation

Sumitomo Wiring Systems, Limited

Fumitoshi Ikejiri

Sanehiro Yamamoto

Akinori Toyota

Hideki Sakai

Yoshikatsu Amimoto

Kazuo Ishiwatari

Tetsuo Kato

Masahiro Kanda

Kazuto Sugiyama

Katunari Nishimura

Masamitsu Chishima

Satoru Moriya

Takao Nozaki

Akira Nabeshima

Yoshinori Akana

Akio Ishimoto

Keiji Kawamoto

Kotaro Kishimura

Yozo Yamamoto

Noboru Umemto

Hirotaka Aso

The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280.degree. C., particularly preferably (A-1) specific polyamide having a melting point of higher than 300.degree. C., (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C., and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.

Thermoplastic resin composition and molded product thereof

Disclosed is a thermoplastic resin composition comprising

Thermoplastic resin composition and use thereof

Connectors

The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.

Resin composition for forming plated layer and use thereof

The resin composition of the invention comprises as resin components specific aromatic polyamide (A), a specific graft-modified polymer (B), an aliphatic polyamide (C), and plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C. and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.

Polyamide resin composition and connector

The present invention provides resin compositions containing thermoplastic resins. Thermoplastic resins employable for the compositions are polyolefin resins, polyester resins, polystyrene resins, polyamide resins and polyphenylene ether resins. The present invention can be particularly effected by using polyamide, particularly, specific aromatic polyamides. In the present invention, the resin compositions can be improved in various chemical and physical properties such as flame-retardance, moldability, color tone, heat stability, mechanical strength by the use of other resin component and stabilizers such as halogenated organic compounds, modified polyolefins, antimony compounds, phosphorus-containing compounds, amine- or phosphorus-type stabilizers.

Flame retardant polyamide thermoplastic resin composition

A polyamide resin composition which comprises: (A) an aromatic polyamide resin comprising preferably a terephthalic acid component and a diamine component comprising at least one of an aliphatic diamine component and an alicyclic diamine component; (B) a fibrous reinforcement; and (C) at least one additive selected from the group consisting of a salt of the group I, II and III metals of the periodic table of a higher fatty acid salt and an acid ester, a partially saponified ester and a metal salt of an aliphatic carboxylic acid of 26-32 carbons. The resin composition is of high fluidity and mold-releasing properties as well as of high heat resistance and rigidity, so that the composition can be molded with decomposition of the resins.

Polyamide resin compositions

Rolling bearing cages disclosed herein are prepared from compositions comprising an aromatic polyamide which comprises terephthalic acid constituent units, aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and straight-chain aliphatic alkylenediamine constituent units, and glass fibers, and can be easily incorporated into bearing races without damage, resultant bearings capable of being operated over a long period of time without deformation of said cages and deterioration of the lubricant oil.

Rolling bearing cages

A composition comprising (I) a thermally stable polyamide such as an aromatic polyamide, (II) a halogenated polystyrene or a halogenated polyphenylene oxide, and (III) sodium antimonate has excellent fire retardancy and excellent thermal stability during molding. The thermal stability of the composition is further enhanced by including (IV) a hydrotalcite-type complex hydroxide or (V) magnesium oxide and/or zinc oxide.

Fire-retardant polyamide composition having good heat resistance

Cycloolefin type random copolymer compositions

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Yamaguchi, Japan

Fumitoshi Ikejiri