Panasonic Intellectual Property Management Co., Ltd.

Fumito Suzuki

Hiroharu Inoue

Hiroaki Umehara

Jun Yasumoto

Yuki Inoue

Tatsuya Arisawa

Shunji Araki

Hirohisa Goto

Takehiro Ishida

One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board

Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.

Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board

A core material is prepared, wherein the core material has an insulating layer, and a conductor pattern provided on a surface of the insulating layer. One or more prepreg materials are prepared. Each prepreg material includes a glass cloth, and first and second resin layers which are formed from a semi-cured resin with which the glass cloth is impregnated, and cover the opposite surfaces of the glass cloth, respectively. A laminated body is formed by placing the one or more prepreg materials on one another, such that one prepreg material out of the one or more prepreg materials is provided on the surface of the insulating layer of the core material to cover the conductor pattern. The laminated body is heated and pressed. The glass cloth has an opening ratio ranging from 3% to 15%. The thickness t of the first and second resin layers, the ratio a (%) of the area of the conductor pattern to the area of the surface of the insulating layer in the core material, the thickness T of the conductor pattern, and the number n of the one or more prepreg materials satisfy the relationships: T&#x2267;100 (&#x3bc;m): and t&#x3c;(1&#x2212;a/100)&#xb7;T&#x3c;2&#xb7;n&#xb7;t.

Method for fabricating wiring board

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Fukushima, Japan

Fumito Suzuki