Matsushita Electric Industrial Co., Ltd.

Matsushita Electronics Corporation

Panasonic Corporation

Fumito Itoh

Masanori Minamio

Yuichiro Yamada

Satoru Konishi

Yoshihiko Morishita

Toshiyuki Fukuda

Takeshi Morikawa

Ichiro Okumura

Akio Kuito

A resin molded type semiconductor device has: a semiconductor chip () which is mounted on a die pad portion () of a lead frame (); thin metal wires () which connect terminals of the semiconductor chip () to inner lead portions () of the lead frame (); and a sealing resin (), and the lead frame () is subjected to an upsetting process so that a supporting portion () is located at a position higher than the inner lead portions (). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions (), the anchoring effect to the sealing resin (), stress acting on a lead portion of a product, and stress to the thin metal wires () can be relaxed, and leads and the thin metal wires can be prevented from peeling off.

Resin molded type semiconductor device and a method of manufacturing the same

Resin molded semiconductor device on a lead frame and method of manufacturing the same

A plastic encapsulated semiconductor device comprises a die pad, die pad support pins suspending the die pad, a semiconductor chip mounted on the die pad, thin metal wires for connecting the electrode of the semiconductor chip to leads, and a sealing resin sealing the foregoing components, while the respective bottom faces of the leads forming terminal portions are exposed. An upset process is performed with respect to the die pad support pins of a lead frame to form stepped portions such that the die pad is positioned higher in level than the leads. Since the lower portion of the sealing resin also underlies the die pad, enhanced adhesion is achieved between the die pad and the sealing rein, resulting in higher reliability. With the die pad positioned higher in level than the leads, there is no possibility of interference between the leads and the semiconductor chip even when the size of the semiconductor chip is freely changed. This enables the scaling up of a semiconductor chip and increases a packaging density in mounting semiconductor devices on a mother substrate.

Plastic encapsulated semiconductor device and method of manufacturing

Growing community of inventors

Osaka, Japan

Fumito Itoh