Ultramemory Inc.

Fumitake Okutsu

Takao Adachi

A semiconductor module that enables reduction of manufacturing costs, a method for manufacturing the same, and a semiconductor module mounting body. The semiconductor module having a plurality of stacked dies includes: a first die; a second die disposed side by side with respect to the first die in a direction intersecting with a stacking direction; a third die disposed in the stacking direction, so as to straddle the first die and the second die and that is electrically connected to wiring surfaces of the first die and the second die opposing the third die; projection terminals projecting from the wiring surfaces of the first die and the second die and that project in a space adjacent to at least one of side surfaces of the third die in the direction intersecting with the stacking direction; and rewiring layers disposed so as to overlap with the projection terminals.

Semiconductor module, method for manufacturing same, and semiconductor module mounting body

The present invention provides a semiconductor module, a semiconductor member, and a method for manufacturing the same that make it possible to improve heat dissipation efficiency. This semiconductor modulecomprises: a power supply unit; a RAM unit, which is a RAM module having a facing surface disposed so as to face an exposed surface of a logic chipand an exposed surface of the power supply unit, the RAM module being disposed across some of a plurality of logic chip signal terminalsand some of a plurality of power supply unit power supply terminals; and a support substratehaving a power feeding circuit capable of feeding electrical power to the logic chip and to the power supply unit, one main surface of the support substratebeing disposed adjacent to a heat dissipation surface of the RAM unit, which is the surface of the RAM unitopposite the facing surface. The support substrateis electrically connected, using the power feeding circuit, to at least some of logic chip power supply terminalsand the other power supply unit power supply terminals. The support substratehas, at positions overlapping the RAM unit, heat dissipation viasthat penetrate in the thickness direction and come into contact with the heat dissipation surface of the RAM unit

Three-dimensional semiconductor module including system in a package (SIP) with improved heat dissipation efficiency

The present invention is intended to provide a semiconductor module and a DIMM module that are capable of stably supplying power to a plurality of stacked memory chips, a manufacturing method of the semiconductor module and a manufacturing method of the DIMM module. The semiconductor modulehaving a plurality of memory chipsincludes: a memory substratehaving a power supply circuitexposed on an arrangement surface as one surface of the memory substrate; and at least one memory unitarranged over the arrangement surface of the memory substrate. The memory unitincludes: the plurality of memory chipsstacked together such that a stacking direction D is along the arrangement surface; a through electrodepassing through the plurality of memory chipsin the stacking direction D; and an electrode layerformed on one end surface in the stacking direction D and connected to the through electrodeand the power supply circuit

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Tokyo, Japan

Fumitake Okutsu