Ibiden Company Limited

Fumitaka Takagi

Toru Furuta

Kotaro Takagi

Michio Ido

Nobuhisa Kuroda

Mariko Kimura

Akihiro Miyata

A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

Method for manufacturing printed wiring board

A printed wiring board includes an interlayer resin insulation layer, a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device, and a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of the pad structure from the solder-resist layer. The opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion is exposing an upper surface and a portion of a side surface of the pad structure.

Method for manufacturing printed wiring board and printed wiring board

A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.

Wiring board and method for manufacturing wiring board

A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

Printed wiring board

A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.

Growing community of inventors

Ogaki, Japan

Fumitaka Takagi