Tokyo Electron Limited

Fumio Satou

Mitsuhiro Sakai

Kiyomitsu Yamaguchi

Yoichi Honda

Yoshitaka Matsuda

Takeshi Tsukamoto

Kiyohisa Tateyama

Kimio Motoda

Tetsuya Sada

Hiroshi Hashimoto

Norio Uchihira

Masaaki Yoshida

A method for a cleaning treatment including a step of forming, in a coating mechanism, a coating film on a substrate provided within a cup. The method further includes dissolving, in an edge cleaning mechanism, a portion of the coating film on the substrate using a cleaning liquid, and recovering at least a portion of used cleaning liquid from the edge cleaning mechanism. The recovered cleaning liquid is stored and a level of the stored cleaning liquid is detected. The method also includes supplementing a fresh cleaning liquid to the stored cleaning liquid when a detected level of the stored cleaning liquid is lower than a predetermined level, and using a mixture of the supplemented fresh cleaning liquid and the stored cleaning liquid to clean the cup of the coating mechanism.

Method and apparatus for cleaning treatment

An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

A cleaning unit for cleaning a substrate is disclosed, that comprises a holding mechanism for rotatably and horizontally holding the substrate, a first traveling means for holding both sides of a cleaning mechanism having at least one cleaning member and for moving the cleaning mechanism in such a manner that the first traveling means is kept in parallel with the substrate held by the holding mechanism, and a second traveling means for holding both sides of a processing solution supplying mechanism having supplying mechanisms for supplying different types of processing solution and for moving the cleaning mechanism in such a manner that the second traveling means is kept in parallel with the substrate held by the holding mechanism. Thus, the strength of the cleaning unit according to the present invention is higher than the strength of a conventional cleaning unit that holds an arm on one side thereof. In addition, a process of a cleaning mechanism and a process of a supplying mechanism can be equally performed on the entire surface of the substrate.

Substrate cleaning unit and cleaning method

Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.

Apparatus and method for supplying process solution to surface of

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Kikuchi-gun, Japan

Fumio Satou