Mitsubishi Denki Kabushiki Kaisha

Fumio Nogami

Hirofumi Fujioka

Hiromi Ito

Hirozoh Kanegae

Yoshifumi Itabashi

Takumi Kikuchi

Masaru Tsuchihashi

Toshiharu Ando

Kazuo Yasuda

Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

Epoxy resin composition for molding having improved mechanical

'Molded products for high voltage apparatus comprising an' epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, 'epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin'. The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

Molded products for high voltage apparatus comprising brominated epoxy

An epoxy resin composition which comprises an epoxy resin having an epoxy equivalent of at most 200; a condensation mixture (A) of a polybasic carboxylic acid anhydride, a bisphenol A having the formula: ##STR1## and a polyhydric alcohol, as a curing agent; and an inorganic powder, as a filler.

Epoxy resin composition

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Amagasaki, Japan

Fumio Nogami