Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Other

Sharp Corporation

Hitachi Co., Ltd

Fumio Inoue

Yoshiaki Tsubomatsu

Toshio Yamazaki

Masanori Ogino

Hiroshi Nomura

Shinsuke Hagiwara

Naoki Fukutomi

Masahiro Eto

Ryuuichi Someya

Noriyuki Taguchi

Hirohito Ohhata

Takeo Yamada

Kouji Kitou

Akio Yamamoto

Ikuya Arai

Shigeru Mori

Sadao Tsuruga

Masami Yusa

Hidehiro Nakamura

Yoshiaki Iwahara

Kunio Ando

Yasuhiro Imai

Tamotsu Nagabayashi

Shigeki Ichimura

Kouzou Masuda

Jiro Kawasaki

Tsuyoshi Sano

Masatoshi Hirose

Nobuaki Kabuto

Atsushi Maruyama

Akishi Nakaso

Kiyoshi Yamamoto

Yoshiki Sota

Shigeharu Arike

Yorio Iwasaki

Hiroshi Jitsukata

Hiroyuki Urata

Koji Miyata

Yasuhiko Awano

Tomoaki Yamashita

Akira Shimizu

Nobuyuki Suzuki

Toshiaki Tanaka

Akira Nagai

Michio Masuda

Itsuo Watanabe

Takashi Kubota

Miyuki Ikeda

Kazunori Yamamoto

Masaaki Yasuda

Kazutaka Naka

Fumio Haruna

Tomohisa Ohta

Kazuyoshi Kojima

Aizou Kaneda

Osamu Watanabe

Tetsuya Enomoto

Toyota Honda

Kenzo Takemura

Norio Moriike

Yasuo Inoue

Masaharu Matsuura

Takeshi Maruyama

Masaaki Iwanaga

Toshihiko Kato

Naoyuki Shiozawa

Yasuharu Tamuro

Masaro Kaku

Sumiko Nakajima

Toyoki Ito

Hiroyuki Torii

Hiroto Ohata

Kousuke Hiroki

Mayumi Igarashi

Satoru Takashimizu

Jun Kobayashi

Noboru Sakai

Shoei Shimaoka

Sadao Itou

An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 &#x3bc;m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

Method for surface treatment of copper and copper

Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 &#x3bc;m on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.

Method of treating the surface of copper and copper

An image display system includes a display device, an input section to which video signals of an interlace scanning system are inputted, a signal converter section which increases horizontal scanning lines of the inputted video signals in number by a factor of at least two, and which generates first and second fields, each of the fields including effective scanning lines used for displaying and ineffective scanning lines not used for displaying, with the effective and ineffective scanning lines being arranged alternately in each of the fields, and a display control section which controls the display device to display the first and second fields alternately. The display control section controls the display device such that positions of the effective scanning lines of the first fields correspond with those of the ineffective scanning lines of the second fields, and vice versa.

Image display system

A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Fabrication process of semiconductor package and semiconductor package

An image display system includes a memory for storing at least one scanning line of an inputted video signal of the interlace scanning system, and reading means for repeating to read the video signal of one scanning line from the memory at a speed which is n (n is an integer of 2 or more) times of the writing speed of the video signal for the memory for a horizontal scanning period which is 1/n of the writing period and to stop reading for a horizontal scanning period of the remaining (n&minus;1)/n for each scanning line of one field which is sequentially inputted and reading each scanning line so that the continuous fields interpolate the period of stopping of reading from the memory each other.

In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.

Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them

A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

Method of production of semiconductor device

A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

Substrate for holding a chip of semi-conductor package, semi-conductor

An image display system includes a display circuit which displays an image composed of a plurality of sub-images, an input circuit which inputs a certain image signal including at least one sub-image embedded in the certain image signal which is provided by at least one of fields and frames, a designating circuit which designates timings of composition positions of the sub-image on scan lines of the certain image, and one control circuit which controls at least one of an amplitude level and a DC level of image signals corresponding to an area of the sub-image detected by the timing designated by the designating circuit.

A liquid crystal projection display capable of functioning at a high light capturing efficiency and a high relative corner illuminance comprises a light source means including a light source, a liquid crystal panel means, a projection lens means and a screen means. A liquid lens formed by sealing a liquid in a space between opposite transparent members is disposed near the light source or the real image of the light source to enhance the relative corner illuminance without reducing the light capturing efficiency by multiplying the angle of divergence of light rays emitted by the light source by the reciprocal of the refractive index of the liquid. A first optical system disposed on the entrance side of the liquid crystal panel is provided with a relative corner illuminance enhancing means comprising a first light converging means disposed relatively near to the light source means, and a second light converging means disposed relatively remote from the light source means. The first light converging means enhances the relative corner illuminance on the entrance surface of the second light converging means.

Liquid crystal Projection display

Growing community of inventors

Yokohama, Japan

Fumio Inoue