Somar Corporation

Hitachi Techno Engineering Co., Ltd.

Hitachi Techno

Fumio Hamamura

Shigeo Sumi

Mitsuhiro Seki

Ichio Fukuda

Sigeo Sumi

Noriyasu Sawada

Yasuhiro Nagafuchi

Takao Matsuo

Yukio Oka

Katsuyoshi Watanabe

A film peeling method for peeling a film bonded to a board, one end portion of the film overhanging from one end of the board, comprises the steps of: fixing the board by adsorbing the board in a predetermined position; clamping the one end portion of the film overhanging from the board fixed in the predetermined position by a peel hand extending in parallel with the film; causing the peel hand to make an arcuate movement with the one end portion of the film clamped, the arcuate movement being made within a plane orthogonal to the board with the vicinity of a surface of the board as the center of an arc while adjusting a position of the peel hand so as to face to the center of the arc, the peel hand moving away from the board and lifting the one end portion of the film in a direction of other end of the board during the arcuate movement; moving the lifted one end portion of the film in the direction of the other end of the board with the peel hand clamping the one end portion of the film, and further forwarding the one end portion of the film out of the board at least up to such a position as to peel other end portion of the film off the board while passing over the other end of the board; and releasing the film outside the board.

Film peeling method and apparatus

A film peeling apparatus is disclosed wherein a base plate stuck with the films is conveyed to a film peeling position, where a contact tightness of leading edges of the films to the base plate is reduced by a film contact tightness reducer while relative moving speed of the base plate and the reducer is decreased by slowing down the conveyance speed of the base plate or by moving the reducer in synchronism with the conveyance of the base plate without stopping the conveyance of the base plate.

Film peeling method and apparatus for practicing same

An apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.

Apparatus for bonding continuous thin film to discrete base plates and

Film remover

A conveying mechanism, particularly useful with a printed-circuit board laminator, in which the board is conveyed by several conveyor rollers having a small gap against several guide members, such as rollers, to accommodate the board and prevent its warping. A sliding device aligns the board as it is transported by the rollers.

Apparatus for conveying base with crosswise base sliding device

A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.

A thin film laminating apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure laminating roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film laminating apparatus.

Adjustable film cutoff unit

A method in which a thin continuous film for conveying a base plate put on the film and another thin continuous film stuck to the main surface of the plate are automatically cut out along the contour of the plate, wherein a cutter is moved to one end of each edge of the plate from an optional position distant from the edge and is thereafter moved to the other end of the edge from another optional position distant from the edge, and movement of the cutter is performed with regard to all the edges of the plate sequentially.

Method of cutting thin film out and device for practicing same

A film guide device for film bonding in which a movable guide roller support and guides the film and swing roller arms prevent the slackening of the film while the film is being fed. Also, a driving action of a rotation-drive source, which controls the movement of the movable guide roller support arms, is synchronized with the braking of the film supply role and the movement of the leading edge of the film towards the bonding surface. This device prevents longitudinal wrinkles in the film, misplacement on the bonding surface, and excessive tension on the film.

Film guide device for a film bonding apparatus

A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.

Thin film bonding method employing a structure for removing wetting

A film sticking method is disclosed in which the tip of the cutting portion of a sharp-pointed cutting member is caused to pierce a continuous film. The member is moved rightward and leftward across the direction of the feed of the film so that the film is cut off to a prescribed length. The cut-off film is stuck to a base plate. Also, a film sticking apparatus is disclosed which includes a film cutter for cutting off a continuous film to a prescribed length by moving a cutting member across the direction of the feed of the film and sticks the cut-off film to a base plate. The cutting member is formed so that it is sharp-pointed and has a cutting edge at least one side of edges of the member. The cutting edge can be moved backward and forward relative to the surface of the continuous film.

Film sticking method and apparatus

A base plate conveyor for supplying a base plate storage section at one end of a base plate conveyance passage to the conveyance surface of the passage or receiving the base plate from the passage to the storage section. The conveyor is characterized by including the base plate storage section in which a plurality of base plates can be piled so that the base plates are leant against the inside of the section and the conveyed surface of the base plates have a predetermined angle to the conveyance surface of the conveyance passage; and a base plate mover provided at the casing of the conveyor so as to automatically move the base plate from the storage section to the conveyance passage or from the conveyance passage to the storage section. The base plate mover includes a vertically swung arm member, which is swung vertically and translated so as to move the base plate between the base plate storage section and the base plate conveyance passage. The arm member is provided with a suction so as to suck the conveyed surface of the base plate by vacuum action. The base storage section is mounted on a carrying stand which is independently movable and is removably attached to the base plate conveyor.

Base plate conveyor

Apparatus and method for pressure and heat sticking a thin film to a base plate. The thin film and a base plate on a film like carrier are introduced into a vacuum chamber having upper and lower contact members for compressing the thin film, base member and carrier into a stratified body. The thin film and base plate are held separate from one another in the chamber. The lower contact member moves upward to contact the carrier and base plate and to compress the stratified body between it and the upper contact member. The upper contact member is convex in shape and made of an elastic material so that the contact pressure on the thin film and base plate starts near the center and spreads toward the periphery resulting in improved sticking of thin film to the base plate with no air bubbles and no wrinkling. The pressure is applied in a vacuum or reduced atmospheric pressure and heat is simultaneously applied. A further compression in the air at atmospheric pressure is carried out by a heat and pressure roller.

Method and apparatus for pressure sticking a thin film to a base plate

A thin-film coating apparatus for coating a surface of a substrate with a thin film wherein the creation of void spaces can be prevented on the contacting surfaces between the laminated film and the electrically conductive layer formed on a substrate. The apparatus includes wet rollers which are arranged along the substrate conveyace path prior to a tacking position where the thin-films are temporarily tacked to the substrate. The wet rollers deposit a void preventing agent on the substrate so as to provide a secure lamination. So as to insure that the agent will be supplied to the wet rollers, the apparatus includes supply pipes, flexible dams, means for supplying the agent to the supply pipes and a plurality of holes formed in the supply pipes.

Growing community of inventors

Kanagawa, Japan

Fumio Hamamura