Hitachi Chemical Company, Ltd.

Fumio Furusawa

Shinsuke Hagiwara

Haruaki Sue

Seiichi Akagi

Akihiro Kobayashi

Ryoichi Ikezawa

Hideki Yokoyama

Mitsuo Katayose

Mitsuyoshi Hamada

Shinya Nakamura

Masaki Yoshii

Naoki Nara

Keizo Takemiya

Yoshinori Endou

Kazuyoshi Tendo

Takaki Kashihara

Hideyuki Chaki

Yoshihiro Mizukami

Toru Baba

Takashi Yamamoto

Takatoshi Ikeuchi

An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

Epoxy resin molding material for sealing and electronic component device

An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 &#x3bc;m or less and a specific surface area of 3.0 m/g or more.

Epoxy resin molding material for sealing use and semiconductor device

This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar and Ar are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Phenyl, naphthly or fluorene cyclopentyl epoxy resins

This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar,and Ar,are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Phenyl, naphthyl or fluorene cyclopentyl epoxy resins

The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.

Phenolic resin, resin composition, molding material for encapsulation, and electronic component device

Growing community of inventors

Tsukuba, Japan

Fumio Furusawa