Mitsubishi Electric Corporation

Fuminori Sameshima

Jun Nishihara

Kenji Harauchi

Yoshinori Tsuyama

Takuo Morimoto

Masahiko Kohama

A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

High frequency module

A compact high frequency switch needing no external control signal is obtained. The high frequency switch includes an anti-parallel diode (first anti-parallel diode) having one end and another end coupled with an antenna terminal (first high-frequency-signal input/output terminal) and a transmitting terminal (second high-frequency-signal input/output terminal), respectively, and becoming a conduction state in the input power not less than predetermined high frequency power. When the high frequency switch is an SPDT type, such a switch may include a &#xbc;-wavelength line in the use frequency of the high frequency switch having one end and another end coupled with the antenna terminal and a receiving terminal (third high-frequency-signal input/output terminal), respectively, and an anti-parallel diode (second anti-parallel diode) coupled between the receiving terminal and a ground and becoming a conduction state in the input power not less than predetermined high frequency power.

Growing community of inventors

Chiyoda-ku, Japan

Fuminori Sameshima