Namics Corporation

Fuminori Arai

Kazuki Iwaya

Takeshi Kumano

Naoto Okumura

Ayako Sato

Akikazu Matsuda

A curing agent composition is capable of curing a base resin containing a 2-methylene-1,3-dicarbonyl compound. The curing agent composition contains a specific 2-methylene-1,3-dicarbonyl compound and an initiator. A two-part mixing adhesive contains the curing agent composition and a base resin containing another specific 2-methylene-1,3-dicarbonyl compound.

Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound

A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.

Resin composition

A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below. 

Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CHOR)(CHOR)(CHOR)(CHOR) (wherein R, R, Rand Rare each independently hydrogen or CHSH (wherein n is 2 to 6), at least one of R, R, Rand Ris CHSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module

A resin composition contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKof 8 or greater. The 2-methylene-1,3-dicarbonyl compound contains a structural unit represented by the following formula (I) 

The present invention is intended to provide a semiconductor device including adherends bonded with a cured product of an adhesive, the semiconductor device being configured such that a decrease in bonding strength after curing in a moisture resistance test is suppressed. In this semiconductor device, at least two adherends 20 and 70, 70 and 60, 70 and 50 made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal are bonded with a cured product 10 of an adhesive containing (A) thermosetting resin, (B) a particular thiol compound, and (C) a latent curing agent.

Semiconductor device and image sensor module

There is provided a resin composition which can be thermoset at a temperature of approximately 80&#xb0; C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.5 equivalents in terms of the ratio of the thiol equivalent of the compound of the (A) component and the oligomer of the (B) component with respect to the epoxy equivalent of the (C) component. In addition, the chloride ion concentration in the resin composition is 230 ppm or less.

There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.

Resin composition, adhesive agent, and sealing agent

A resin composition containing (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent is provided. The compound of the (B) component has a content of 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 50 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1. 

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Niigata, Japan

Fuminori Arai